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Patent # Description
US-7,638,813 Methods of fabrication for flip-chip image sensor packages
The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the...
US-7,638,436 Semiconductor processing methods of transferring patterns from patterned photoresists to materials
The invention includes a semiconductor processing method. A first material comprising silicon and nitrogen is formed. A second material is formed over the first...
US-7,638,392 Methods of forming capacitor structures
The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger...
US-7,638,357 Programmable resistance memory devices and systems using the same and methods of forming the same
A programmable resistance memory element and method of forming the same. The memory element includes a first electrode, a dielectric layer over the first...
US-7,637,412 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece
Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and...
US-7,636,271 User selectable banks for DRAM
A memory device includes a configurable array of memory cells. A number of array banks is configured based upon data stored in a mode register or decoded by...
US-7,635,991 Output buffer strength trimming
Apparatus and methods for adjusting the buffer strength of an output buffer to match its capacitive load use selectively enabled stages of a multiple stage...
US-7,635,630 Scalable high density non-volatile memory cells in a contactless memory array
A plurality of mesas are formed in the substrate. Each pair of mesas forms a trench. A plurality of diffusion areas are formed in the substrate. A mesa diffusion...
US-7,635,623 Methods of forming capacitors
A method of forming a capacitor includes forming a conductive first capacitor electrode material comprising TiN over a substrate. TiN of the TiN-comprising...
US-7,635,611 Semiconductor substrate for build-up packages
The present invention provides techniques to fabricate build-up single or multichip modules. In one embodiment, this is accomplished by dispensing die-attach...
US-7,635,604 Well for CMOS imager and method of formation
A well region of a first conductivity type located in a substrate of the first conductivity type and below about half the channel length of an electrically...
US-7,635,132 Filter cloth connector
Apparatuses and methods for making and using a filter cloth assembly are described. A filter cloth assembly can have a liquid permeable filtering medium attached...
US-7,635,079 System for locating conductive sphere utilizing screen and hopper of solder balls
System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads....
US-7,634,851 Method of forming a magnetic random access memory element
A method of forming a magnetic tunnel junction memory element and the resulting structure are disclosed. A magnetic tunnel junction memory element comprising a...
US-7,634,624 Memory system for data storage and retrieval
According to a first aspect of an embodiment of the invention, there is provided a method of data storage and retrieval for use in a solid state memory system,...
US-7,634,623 Method and apparatus for self-timed data ordering for multi-data rate memories and system incorporating same
A self-timed data ordering method and circuit for multi-data rate memories orders a plurality of data words substantially simultaneously retrieved during...
US-7,634,597 Alignment of instructions and replies across multiple devices in a cascaded system, using buffers of...
Buffers of programmable depths are used in the instruction and reply paths of cascaded devices to account for possible differences in latencies between the...
US-7,633,821 Current mode memory apparatus, systems, and methods
Some embodiments include a first circuit to receive input signals and to drive signals at first circuit output nodes, and a second circuit to receive at least a...
US-7,633,804 Adjusting programming or erase voltage pulses in response to the number of programming or erase failures
Memory devices and methods of operating memory devices are provided. In one such embodiment a programming voltage pulse or an erase voltage pulse is applied to...
US-7,633,801 Memory in logic cell
Methods, devices, and systems for a memory in logic cell are provided. One or more embodiments include using a cell structure having a first gate, a second gate,...
US-7,633,798 M+N bit programming and M+L bit read for M bit memory cells
A memory device and programming and/or reading process is described that programs and/or reads the cells in the memory array with higher threshold voltage...
US-7,633,786 Couplings within memory devices and methods
Methods and apparatus are provided. A memory device includes a first bit line selectively coupled to an input of a sensing device through a first multiplexer...
US-7,633,773 On-die anti-resonance structure for integrated circuit
A structure and method for reducing the effects of chip-package resonance in an integrated circuit assembly is described. A series RLC circuit is employed to...
US-7,633,423 Method of and apparatus for reducing settling time of a switched capacitor amplifier
A method and apparatus for reducing settling time of a switched capacitor amplifier. The method includes disconnecting first and second capacitors from an...
US-7,633,159 Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other...
A sacrificial substrate for fabricating semiconductor device assemblies and packages with edge contacts includes conductive elements on a surface thereof, which...
US-7,633,157 Microelectronic devices having a curved surface and methods for manufacturing the same
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a device includes a support member and a...
US-7,633,116 One-transistor composite-gate memory
One-transistor memory devices facilitate nonvolatile data storage through the manipulation of oxygen vacancies within a trapping layer of a field-effect...
US-7,632,747 Conductive structures for microfeature devices and methods for fabricating microfeature devices
Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein....
US-7,632,737 Protection in integrated circuits
A method including, prior to a plasma heat-up operation, forming a liner on structure coated with an insulator. And a method including forming a trench on a...
US-7,632,702 Methods of forming a resistance variable element
The invention includes methods of depositing silver onto a metal selenide-comprising surface, and methods of forming a resistance variable device. In one...
US-7,631,170 Program controlled embedded-DRAM-DSP having improved instruction set architecture
An efficient embedded-DRAM processor architecture and associated methods. In one exemplary embodiment, the architecture includes a DRAM array, a set of register...
US-7,630,266 Temperature compensation of memory signals using digital signals
A temperature sensor generates a digital representation of the temperature of the integrated circuit. A logic circuit reads the digital temperature and generates...
US-7,630,265 On-chip temperature sensor
A temperature invariant reference voltage and a temperature variant physical quantity, such as a voltage or current, are generated. The temperature variant...
US-7,630,256 Erase operation in a flash drive memory
A method for erasing a non-volatile memory device performs a block erase operation. The cells are then soft programmed and erase verified to determine if the...
US-7,630,246 Programming rate identification and control in a solid state memory
Memory devices adapted to receive and transmit analog data signals representative of bit patterns of two or more bits facilitate increases in data transfer rates...
US-7,630,241 Single latch data circuit in a multiple level call non-volatile memory device
A single latch circuit is coupled to each bit line in a multiple level cell memory device to handle reading multiple data bits. The circuit is comprised of a...
US-7,630,240 Read method for MLC
Memory devices adapted to process and generate analog data signals representative of data values of two or more bits of information facilitate increases in data...
US-7,630,236 Flash memory programming to reduce program disturb
The method for reducing program disturb in a flash memory array biases a selected wordline at a programming voltage. One of the unselected wordlines, closer to...
US-7,630,024 Assemblies and methods for illuminating a display
A computer display is disclosed. The computer display includes a LCD housing, a light source coupled to the LCD housing, and a LCD coupled to the LCD housing....
US-7,630,008 Method of controlling image quality of an integrated CMOS imager and microcontroller
A method and apparatus providing a CMOS imager with an integrated controller on a common integrated circuit substrate. Also integrated on the common substrate...
US-7,629,858 Time delay oscillator for integrated circuits
One aspect relates to an oscillator, and various oscillator embodiments comprise an amplifier and line driver with an input and an output and a transmission line...
US-7,629,819 Seamless coarse and fine delay structure for high performance DLL
A clock synchronization system and method avoids output clock jitter at high frequencies and also achieves a smooth phase transition at the boundary of the...
US-7,629,807 Electrical test probe
A probe for electrical test comprises a plate-shaped main portion having a base end to be attached to a support board and a tip end opposite the base end, and a...
US-7,629,736 Method and device for preventing junction leakage in field emission devices
An apparatus and method for stabilizing a threshold voltage in an active matrix field emission device are disclosed. The method includes formation of...
US-7,629,693 Method for integrated circuit fabrication using pitch multiplication
Different sized features in the array and in the periphery of an integrated circuit are patterned on a substrate in a single step. In particular, a mixed...
US-7,629,686 Bumped die and wire bonded board-on-chip package
An apparatus for making a semiconductor assembly and, specifically, interconnecting a semiconductor die to a carrier substrate. The carrier substrate includes a...
US-7,629,641 Band engineered nano-crystal non-volatile memory device utilizing enhanced gate injection
Non-volatile memory devices and arrays are described that utilize reverse mode non-volatile memory cells that have band engineered gate-stacks and nano-crystal...
US-7,629,630 Electropolished patterned metal layer for semiconductor devices
An electropolishing process for high resolution patterning of noble metals, such as platinum, for forming various semiconductor devices, such as capacitors or...
US-7,629,266 Etch compositions and methods of processing a substrate
The invention includes an etchant composition containing isopropyl alcohol and one or more of HF, NH.sub.4F and tetramethyl ammonium fluoride (TMAF). The...
US-7,629,250 Method for creating electrically conductive elements for semiconductor device structures using laser ablation...
A method for forming at least one conductive element is disclosed. Particularly, a semiconductor substrate, including a plurality of semiconductor dice thereon,...
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