At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
Atomic layer deposited barium strontium titanium oxide films
Apparatus and methods of forming the apparatus include a dielectric layer containing barium strontium titanium oxide layer, an erbium-doped barium strontium...
Systems and methods for processing microfeature workpieces
Systems and methods for processing microfeature workpieces are disclosed herein. In one embodiment, the system comprises a processing chamber having a workpiece...
Atomic layer deposited titanium-doped indium oxide films
An apparatus and methods of forming the apparatus include a film of transparent conductive titanium-doped indium oxide for use in a variety of configurations and...
Apparatus and methods for manufacturing microfeatures on workpieces using
plasma vapor processes
A reactor comprising an energy source, a plasma unit positioned relative to the energy source, and a processing vessel connected to the plasma unit. The energy...
Method for manipulating data in a group of processing elements according
to locally maintained counts
The present invention is capable of placing or loading input data into a 2D or 3D array of processing elements interconnected in a variety of ways, and moving...
Multiple processor system and method including multiple memory hub modules
A processor-based electronic system includes several memory modules arranged in first and second ranks. The memory modules in the first rank are directly...
Method and apparatus for facilitating purchase transactions across a
A local computer system that provides and records information to facilitate a purchase transaction across a network operates by first receiving a request for...
Program and read trim setting
A method and apparatus for setting trim parameters in a memory device provides multiple trim settings that are assigned to portions of the memory device...
Selective threshold voltage verification and compaction
Non-volatile memory devices for providing selective compaction verification and/or selective compaction to facilitate a tightening of the distribution of...
System and memory for sequential multi-plane page memory operations
A system and method for performing memory operations in a multi-plane flash memory. Commands and addresses are sequentially provided to the memory for memory...
Flash memory cells with reduced distances between cell elements
An anti-reflective coating (ARC) is formed over the various layers involved in a cell fabrication process. The ARC is selectively etched such that the edges of...
MOS linear region impedance curvature correction
A system and method to correct or cancel MOS linear region impedance curvature employing an analog solution to trim out the MOS linear region impedance curvature...
Methods for packing microfeature devices and microfeature devices formed
by such methods
Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods...
Super high density module with integrated wafer level packages
A wafer level package, and a semiconductor wafer, electronic system, and a memory module that include one or more of the wafer level packages, and methods of...
Access transistor for memory device
An access transistor for a resistance variable memory element and methods of forming the same are provided. The access transistor has first and second...
Topography directed patterning
A pattern having exceptionally small features is formed on a partially fabricated integrated circuit during integrated circuit fabrication. The pattern comprises...
Methods and systems for fabricating semiconductor components with through
wire interconnects (TWI)
A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact....
High performance multi-level non-volatile memory device
Non-volatile memory devices and arrays are described that utilize band engineered gate-stacks and multiple charge trapping layers allowing a multiple trapping...
Method of making vertical transistor with horizontal gate layers
Vertical body transistors with adjacent horizontal gate layers are used to form a memory array in a high density flash electrically erasable and programmable...
Container capacitor structure and method of formation thereof
Disclosed is a container capacitor structure and method of constructing it. An etch mask and etch are used to expose portions of an exterior surface of electrode...
Method of coating contacts on a surface of a flip chip
A method for encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of...
Peripheral device with hardware linked list
A linked list is implemented in hardware. Various registers within the linked list are writeable until a control register is written, rendering the registers...
Caching of dynamic arrays
Systems and methods are provided for caching dynamic arrays. According to one aspect, a cache memory device is provided for caching dynamic arrays or dynamic...
Method and system for generating reference voltages for signal receivers
A method and system for generating a reference voltage for memory device signal receivers operates in either a calibration mode or a normal operating mode. In...
Resistive memory element sensing using averaging
A system for determining the logic state of a resistive memory cell element, for example an MRAM resistive cell element. The system includes a controlled voltage...
Non-volatile multilevel memory cells with data read of reference cells
Embodiments of the present disclosure provide methods, devices, modules, and systems for non-volatile multilevel memory cell data retrieval with data read of...
Multi-state memory cell with asymmetric charge trapping
A multi-state NAND memory cell is comprised of two drain/source areas in a substrate. An oxide-nitride-oxide structure is formed above the substrate between the...
Boron-doped amorphous carbon film for use as a hard etch mask during the
formation of a semiconductor device
A hard mask comprising boron-doped amorphous carbon, and a method for forming the hard mask, provides improved resistance to etches of a variety of materials...
Circuitry and gate stacks
The present invention includes semiconductor circuitry. Such circuitry encompasses a metal silicide layer over a substrate and a layer comprising silicon,...
Method of composite gate formation
Methods for forming a nitride barrier film layer in semiconductor devices such as gate structures, and barrier layers, semiconductor devices and gate electrodes...
Methods for enhancing capacitors having roughened features to increase
Structures and methods for making a semiconductor structure are discussed. The semiconductor structure includes a rough surface having protrusions formed from an...
Systems and methods for forming metal oxides using metal diketonates
A method of forming (and an apparatus for forming) a metal oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a...
Atomic layer deposition methods
A first precursor gas is flowed to the substrate within the chamber effective to form a first monolayer on the substrate. A second precursor gas different in...
Method for creating conductive elements for semiconductor device
structures using laser ablation processes and...
A method for forming at least one conductive element is disclosed. Particularly, a semiconductor substrate, including a plurality of semiconductor dice thereon,...
Method for making conductive nanoparticle charge storage element
Isolated conductive nanoparticles on a dielectric layer and methods of fabricating such isolated conductive nanoparticles provide charge storage units in...
Stacked die with a recess in a die BGA package
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
Real time testing using on die termination (ODT) circuit
A system and method to operate an electronic device, such as a memory chip, in a test mode using the device's built-in ODT (on die termination) circuit is...
Method for finding global extrema of a set of shorts distributed across an
array of parallel processing elements
A method for finding an extrema for an n-dimensional array having a plurality of processing elements, the method includes determining within each processing...
Internal bias measure with onboard ADC for electronic devices
An apparatus and method for on-chip bias measurement of an analog signals on an integrated circuit with a switchable analog-to-digital converter capable of...
NAND flash memory cell programming
A flash memory device, such as a NAND flash, is described having an array of floating gate transistor memory cells arranged in a first and second addressable...
Mode selection in a flash memory device
A single flash memory device has selectable read modes for either a segment mode or a page mode. The desired mode is selected by writing a control word to a mode...
Self-identifying stacked die semiconductor components
A semiconductor die having a functional circuit (e.g., a memory array) and a decode circuit suitable for use in a stacked die semiconductor component (e.g., a...
Dynamically adjusting operation of a circuit within a semiconductor device
Systems and methods for dynamically adjusting operation of a circuit within a semiconductor device are described herein. At least some illustrative embodiments...
Probe card layout
Multi-touchdown, parallel test probe cards having probe elements arranged to provide greater than 99% efficiency during testing of a substrate having a plurality...
Semiconductor device assemblies and packages including multiple
semiconductor device components
A multidie semiconductor device assembly or package includes an interposer comprising a substrate with at least one receptacle therethrough. A plurality of...
Methods for reducing stress in microelectronic devices and microelectronic
devices formed using such methods
Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods are disclosed herein. One such device can include a...
Method for enhancing electrode surface area in DRAM cell capacitors
Methods for forming the lower electrode of a capacitor in a semiconductor circuit, and the capacitors formed by such methods are provided. The lower electrode is...
Etch aided by electrically shorting upper and lower sidewall portions
during the formation of a semiconductor...
A method used to fabricate a semiconductor device comprises etching a dielectric layer, resulting in an undesirable charge buildup along a sidewall formed in the...
Photodiode with ultra-shallow junction for high quantum efficiency CMOS
image sensor and method of formation
A pinned photodiode with an ultra-shallow highly-doped surface layer of a first conductivity type and a method of formation are disclosed. The ultra-shallow...