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Methods of bonding solder balls to bond pads on a substrate, and bonding
Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame...
Method for securing a subpad to a subpad support
A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad...
Data path for high performance pattern generator
A method and system for a high-speed datapath for a high-performance pattern generator such as an analog SLM for generating the image is disclosed. The data path...
System and method for optimizing interconnections of components in a
multichip memory module
An apparatus and method couples memory devices in a memory module to a memory hub on the module such that signals traveling from the hub to the devices have...
System and method for dynamic buffer allocation
A system for dynamically allocating buffers between components in a computer system is described. The system uses matched sets of bi-directional buffers to...
Low voltage data path and current sense amplifier
Methods, circuits, devices, and systems are provided, including a low voltage data path and current sense amplifier. One data path includes a local input/output...
One-transistor memory cell with bias gate
One-transistor (1T) capacitor-less DRAM cells each include a MOS transistor having a bias gate layer that separates a floating body region from a base substrate....
Startup circuit and method
A startup circuit provides a single connection to a node of a reference or other circuit to be started. The startup circuit injects high current into devices to...
Semiconductor assemblies including redistribution layers and packages and
assemblies formed therefrom
Methods for creating redistribution layers for only selected dice, such as known good dice, to form relatively thin semiconductor component assemblies and...
Stacked semiconductor component
A semiconductor component includes a carrier and multiple semiconductor substrates stacked and interconnected on the carrier. The carrier includes conductive...
The invention includes a method in which a semiconductor substrate is provided to have a memory array region, and a peripheral region outward of the memory array...
Atomic layer deposition and conversion
A method for growing films for use in integrated circuits using atomic layer deposition and a subsequent converting step is described. In an embodiment, the...
Fabrication of semiconductor devices using anti-reflective coatings
Techniques are disclosed for fabricating a device using a photolithographic process. The method includes providing a first anti-reflective coating over a surface...
Semiconductor devices with permanent polymer stencil and method for
manufacturing the same
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces...
Methods for forming interconnects in microelectronic workpieces and
microelectronic workpieces formed using...
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the...
Method of forming apparatus having oxide films formed using atomic layer
A dielectric layer containing an atomic layer deposited insulating metal oxide film having multiple metal components and a method of fabricating such a...
Methods of forming semiconductor constructions and flash memory cells
Some embodiments include methods of forming flash memory cells and semiconductor constructions, and some embodiments include semiconductor constructions. Some...
Dual layer workpiece masking and manufacturing process
The present invention relates to preparation of patterned workpieces in the production of semiconductor and other devices. Methods and devices are described...
Reactors with isolated gas connectors and methods for depositing materials
onto micro-device workpieces
Reactors having isolated gas connectors, systems that include such reactors, and methods for depositing materials onto micro-devices workpieces are disclosed...
Methods and apparatus for electrical, mechanical and/or chemical removal
of conductive material from a...
A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, the method can include engaging a microelectronic...
Memory device controller
A controller for a memory device and methods are provided. The controller has an updateable register bank adapted to send a first signal to an analog/memory core...
Devices, systems, and methods for independent output drive strengths
Methods, apparatuses and systems are disclosed for independently configurable data and strobe drivers within a memory device. A memory device may include at...
Apparatus and methods for programming multilevel-cell NAND memory devices
Methods and apparatus are provided. A first data value is read from a first memory cell and is stored. An attempt is made to add a second data value to the first...
Resistance variable memory with temperature tolerant materials
A PCRAM memory device having a chalcogenide glass layer, preferably comprising antimony selenide having a stoichometric formula of about Sb.sub.2Se.sub.3, and a...
Capacitively-coupled level restore circuits for low voltage swing logic
Some embodiments of the disclosure include a circuit having differential sides and a capacitive network coupled to differential sides. The circuit further...
Electrical test probe and electrical test probe assembly
An electrical test probe comprises a probe tip portion and a probe main body portion having a pedestal portion on which the probe tip portion is formed to be...
Methods of retaining semiconductor component configurations within sockets
The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets....
Probe board mounting apparatus
A mounting apparatus that does not compromise the strength of a probe board. The apparatus comprises a probe board spaced from a support member by a spacer. A...
Memory device with high dielectric constant gate dielectrics and metal
A memory cell transistor includes a high dielectric constant tunnel insulator, a metal floating gate, and a high dielectric constant inter-gate insulator...
Methods of forming semiconductor constructions, and methods of selectively
removing metal-containing materials...
The invention includes methods of selectively removing metal-containing copper barrier materials (such as tantalum-containing materials, titanium-containing...
Controlling diffusion in doped semiconductor regions
A method and device for reducing a dopant diffusion rate in a doped semiconductor region is provided. The methods and devices include selecting a plurality of...
Methods of forming capacitors
The invention includes methods of forming semiconductor constructions and methods of forming pluralities of capacitor devices. An exemplary method of the...
Methods of programming memory cells using manipulation of oxygen vacancies
One-transistor memory devices facilitate nonvolatile data storage through the manipulation of oxygen vacancies within a trapping layer of a field-effect...
Use of dilute steam ambient for improvement of flash devices
The present invention provides a flash memory integrated circuit and a method for fabricating the same. The method includes etching a gate stack that includes an...
Low dark current image sensors with epitaxial SiC and/or carbonated
channels for array transistors
A pixel cell having a substrate with a isolation channel formed of higher carbon concentrate such as SiC or carbonated silicon. The channel comprising SiC or...
Apparatus and method for reducing removal forces for CMP pads
An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable...
Substrate susceptors for receiving semiconductor substrates to be
In one implementation, a substrate susceptor for receiving a semiconductor substrate for selective epitaxial silicon-comprising depositing thereon, where the...
Ampoules for producing a reaction gas and systems for depositing materials
onto microfeature workpieces in...
Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers are disclosed herein. In one...
Data reordering processor and method for use in an active memory device
An active memory device includes a command engine that receives high level tasks from a host and generates corresponding sets of either DCU commands to a DRAM...
Power management control and controlling memory refresh operations
A memory devices provide signals indicating when refresh operations are complete. The signals from a number of memory devices can be combined, such as by Oring,...
Memory utilizing oxide-conductor nanolaminates
One floating gate transistor embodiment includes a first source/drain region, a second source/drain region, and a channel region therebetween. A floating gate is...
Systems and methods for retrieving residual liquid during immersion lens
Systems and methods for retrieving residual liquid during immersion lens photolithography are disclosed. A method in accordance with one embodiment includes...
Delay line off-state control with power reduction
A method and apparatus is provided for controlling a delay line for achieving power reduction. The device comprises a delay lock loop to provide an output signal...
Zero power start-up circuit for self-bias circuit
An improved start-up circuit and method for self-bias circuits is described that applies a start-up voltage and current to a self-bias circuit to initialize its...
Compositions for removal of processing byproducts and method for using
A composition and methods for using the composition in removing processing byproducts is provided. The composition can be non-aqueous or semi-aqueous. The...
Atomic layer deposition methods
An atomic layer deposition method includes providing a semiconductor substrate within a deposition chamber. A first metal halide-comprising precursor gas is...
Method of selectively depositing materials on a substrate using a
A method for depositing one or more materials on a substrate, such as for example, a semiconductor substrate that includes providing the substrate; applying a...
Atomic layer deposited barium strontium titanium oxide films
Apparatus and methods of forming the apparatus include a dielectric layer containing barium strontium titanium oxide layer, an erbium-doped barium strontium...
Systems and methods for processing microfeature workpieces
Systems and methods for processing microfeature workpieces are disclosed herein. In one embodiment, the system comprises a processing chamber having a workpiece...
Atomic layer deposited titanium-doped indium oxide films
An apparatus and methods of forming the apparatus include a film of transparent conductive titanium-doped indium oxide for use in a variety of configurations and...