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Low temperature process for polysilazane oxidation/densification
Semiconductor devices, structures and systems that utilize a polysilazane-based silicon oxide layer or fill, and methods of making the oxide layer are disclosed....
Compositions for dissolution of low-k dielectric films, and methods of use
An improved composition and method for cleaning the surface of a semiconductor wafer are provided. The composition can be used to selectively remove a low-k...
Methods of forming semiconductor constructions having lines
In some embodiments, an opening is formed through a first material, and sidewall topography of the opening is utilized to form a pair of separate anistropically...
Atomic layer deposition systems and methods including silicon-containing
tantalum precursor compounds
The present invention provides atomic layer deposition systems and methods that include at least one compound of the formula (Formula I): ...
Integrated circuit insulators and related methods
A system and method for providing low dielectric constant insulators in integrated circuits is provided. One aspect of this disclosure relates to a method for...
Low k interlevel dielectric layer fabrication methods
A low k interlevel dielectric layer fabrication method includes providing a substrate having integrated circuitry at least partially formed thereon. An oxide...
Vertical transistors for memory cells, such as 4F2 memory cells, are disclosed. The memory cells use digit line connections formed within the isolation trench to...
Methods of fabricating a microlens including selectively curing flowable,
uncured optically trasmissive material
Microlenses for directing radiation toward a sensor of an imaging device include a plurality of mutually adhered layers of cured optically transmissive material....
Intelligent binning for electrically repairable semiconductor chips
The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests...
Device and method for testing integrated circuit dice in an integrated
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse...
Memory with test mode output
Apparatus and methods of forming and operating the apparatus provide an instrumentality for a memory to generate a test mode signal to trigger a test in response...
Method and unit for buffer control
A system unit including a processor unit and an input storage unit. The processor unit generates an input signal and a clock signal. The input storage unit...
System and method for an asynchronous data buffer having buffer write and
A system and method for facilitating the adjustment of timing parameters between a memory controller operating in a first clock domain and a memory device...
Non-volatile memory device with both single and multiple level cells
A non-volatile memory array with both single level cells and multilevel cells. The single level and multilevel cells, in one embodiment, are alternated either...
Switched capacitor for a tunable delay circuit
A method and apparatus is provided for providing a fine delay by switching on a capacitor delay. A coarse delay and/or a fine delay are implemented upon a...
Method of fabricating field emission arrays employing a hard mask to
define column lines and another mask to...
Each pixel of a field emission device includes a resistor with at least one emitter tip thereover and at least one substantially vertically oriented conductive...
Atomic layer deposition of CeO.sub.2/Al.sub.2O.sub.3 films as gate
The use of atomic layer deposition (ALD) to form a nanolaminate layered dielectric layer of cerium oxide and aluminum oxide acting as a single dielectric layer...
Microfeature systems including adhered microfeature workpieces and support
Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes...
Multiple die stack apparatus employing T-shaped interposer elements
Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction...
Semiconductor devices and semiconductor device assemblies including a
nonconfluent spacer layer
A semiconductor device that includes at least one nonconfluent spacer layer on at least one surface thereof. The at least one nonconfluent spacer layer at least...
Graded Ge.sub.xSe.sub.100-x concentration in PCRAM
The present invention provides a design for a PCRAM element which incorporates multiple metal-containing germanium-selenide glass layers of diverse...
DRAM access transistor
Self-aligned recessed gate structures and method of formation are disclosed. Field oxide areas for isolation are first formed in a semiconductor substrate. A...
DRAM layout with vertical FETs and method of formation
DRAM cell arrays having a cell area of about 4F.sup.2 comprise an array of vertical transistors with buried bit lines and vertical double gate electrodes. The...
Memory cell and method for forming the same
A semiconductor memory cell structure having 4F.sup.2 dimensions and method for forming the same. The memory cell is formed on a surface of a substrate and...
Selective etch chemistries for forming high aspect ratio features and
An interlevel dielectric layer, such as a silicon oxide layer, is selectively etched using a plasma etch chemistry including a silicon species and a halide...
Methods for forming through-wafer interconnects and structures resulting
The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a...
Carrier for wafer-scale package, wafer-scale package including the
carrier, and methods
A carrier for use in a chip-scale package includes a semiconductor substrate with a plurality of apertures formed therethrough. The apertures of the carrier are...
Methods of forming wire bonds for semiconductor constructions
The invention includes a semiconductor construction having a wire bonding region associated with a metal-containing layer, and having radiation-imageable...
Molybdenum-doped indium oxide structures and methods
Methods of forming transparent conducting oxides and devices formed by these methods are shown. Monolayers that contain indium and monolayers that contain...
Method of forming a vertical transistor
The invention includes methods of forming epitaxial silicon-comprising material and methods of forming vertical transistors. In one implementation, a method of...
Methods of forming semiconductor constructions
The invention includes methods of forming semiconductor constructions in which electrically conductive structures are formed between bitlines to electrically...
Methods of forming pluralities of capacitors
The invention includes methods of forming pluralities of capacitors. In one implementation, a method of forming a plurality of capacitors includes anodically...
Method for forming an array with polysilicon local interconnects
Methods and apparatus are described to facilitate forming memory devices with low resistance polysilicon local interconnects that allow a smaller array feature...
Capacitorless DRAM on bulk silicon
A method of forming capacitorless DRAM over localized silicon-on-insulator comprises the following steps: A silicon substrate is provided, and an array of...
Fully-depleted (FD) (SOI) MOSFET access transistor and method of
A fully-depleted (FD) Silicon-on-Insulator (SOI) MOSFET access transistor comprising a gate electrode of a conductivity type which is opposite the conductivity...
MRAM layer having domain wall traps
A common pinned layer is shared by multiple memory cells in an MRAM device. The common pinned layer includes a plurality of domain wall traps that prevent the...
Methods for positioning carbon nanotubes
The present invention is generally directed to a system for controlling placement of nanoparticles, and methods of using same. In one illustrative embodiment,...
System and method for on-board diagnostics of memory modules
A memory hub includes an on-board diagnostic engine through which diagnostic testing and evaluation of the memory system can be performed. The memory hub...
Active memory processing array topography and method
An integrated active memory device includes an array of processing elements coupled to a dynamic random access memory device and to a component supplying...
On-die termination snooping for 2T applications in a memory system
implementing non-self-terminating ODT schemes
A method and apparatus for controlling the on-die termination of a memory system. The method comprises snooping a command bus in response to a first plurality of...
Obtaining search results based on match signals and search width
Content addressable memory (CAM) in which search results such as an address code and an array match signal can be obtained for multiple search widths. The CAM...
Memory architecture having local column select lines
A memory architecture for an array of memory cells having a plurality of sections of memory and a plurality of regions disposed between the plurality of sections...
External clock tracking pipelined latch scheme
A flash memory including a first latch having at least one external input to receive at least one command, at least one memory address, and a plurality of data...
Memory block erasing in a flash memory device
The erase and verify method performs an erase operation and an erase verify read operation. If the erase verify read operation fails because unerased memory...
Method and system for reducing mismatch between reference and intensity
paths in analog to digital converters...
A circuit for reducing a mismatch between a reference path to which a reference voltage is applied and an intensity path to which an intensity voltage is applied...
High accuracy current mode duty cycle and phase placement sampling circuit
A duty cycle and phase placement sampling circuit that can be used for high accuracy sampling and correcting the duty cycle and placement of differential clock...
Methods, devices and systems for sensing the state of fuse devices
A fuse sensing circuit includes a sense controller and a fuse state sensor. The sense controller includes a reference fuse and a reference sensor coupled to the...
De-emphasis system and method for coupling digital signals through
capacitively loaded lines
A system for de-emphasizing digital signals, such as address signals, boosts the level of the signals for one clock period prior to transmitting the signals...
Method and apparatus for output driver calibration
An output driver calibration circuit determines calibration values for configuring adjustable impedance output drivers. Output drivers are calibrated by...
Systems configured for utilizing semiconductor components
The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets....