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Patent # Description
US-7,364,997 Methods of forming integrated circuitry and methods of forming local interconnects
In one implementation, field oxide is grown within bulk semiconductive material in a first circuitry area and not over immediately adjacent bulk semiconductive...
US-7,364,985 Method for creating electrical pathways for semiconductor device structures using laser machining processes
A method for creating electrical pathways for semiconductor device structures using laser machining processes is provided. The method of the present invention...
US-7,364,981 Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory...
The invention includes methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating integrated circuitry including...
US-7,364,966 Method for forming a buried digit line with self aligning spacing layer and contact plugs during the formation...
A method for use during fabrication of a semiconductor device comprises the formation of buried digit lines and contacts. During formation, a buried bit line...
US-7,364,934 Microelectronic imaging units and methods of manufacturing microelectronic imaging units
Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one...
US-7,364,644 Silver selenide film stoichiometry and morphology control in sputter deposition
A method of sputter depositing silver selenide and controlling the stoichiometry and nodular defect formations of a sputter deposited silver-selenide film. The...
US-7,363,694 Method of testing using compliant contact structures, contactor cards and test system
A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a...
US-7,363,452 Pipelined burst memory access
A memory device for multichannel continuous or fixed burst mode operation includes multiple burst address counter circuits and associated control logic to...
US-7,363,419 Method and system for terminating write commands in a hub-based memory system
A memory hub receives downstream memory commands and processes each received downstream memory command to determine whether the memory command includes a write...
US-7,362,641 Method and system for low power refresh of dynamic random access memories
A method and system for operating a DRAM device in either a high power, full density mode or a low power, half density mode. In the full density mode, each data...
US-7,362,637 Current switching sensor detector
A sensor for a switching circuit detects the logical state of the switching circuit by monitoring the current flow through the switching circuit. The current...
US-7,362,634 Built-in system and method for testing integrated circuit timing parameters
A built-in self-test system for a dynamic random access memory device using a data output register of the memory device to apply test signals to data bus...
US-7,362,627 Method and apparatus for synchronizing data from memory arrays
According to one embodiment, a combination is comprised of a plurality of sense amps, each having an input for receiving a clock signal. A data bus is for...
US-7,362,619 Data strobe synchronization circuit and method for double data rate, multi-bit writes
A data strobe synchronization circuit includes first and second logic circuits receiving global data strobe pulses and respective enable signal. A control...
US-7,362,611 Non-volatile memory copy back
Data move operations in a memory device are described that enable identification of data errors. During a write operation, identified errors are flagged and used...
US-7,362,113 Universal wafer carrier for wafer level die burn-in
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer...
US-7,362,111 Device for evaluating at least one electrical conducting structure of an electronic component
An apparatus and method for evaluating the integrity of each contact pin of an electronic component having multiple contact pins. In one embodiment, the...
US-7,361,928 Doped aluminum oxide dielectrics
Doped aluminum oxide layers having a porous aluminum oxide layer and methods of their fabrication. The porous aluminum oxide layer may be formed by evaporation...
US-7,361,862 Laser marking system for dice carried in trays and method of operation
A laser marking system for IC packages including a tray input shuttle assembly and a tray transport borne by a transport actuator for moving a tray carrier...
US-7,361,614 Method of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry
This invention includes methods of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry, and to methods of forming trench...
US-7,361,596 Semiconductor processing methods
The invention includes methods of forming titanium-containing materials, such as, for example, titanium silicide. The invention can use alternating cycles of...
US-7,361,569 Methods for increasing photo-alignment margins
Methods and structures are provided for increasing alignment margins when contacting pitch multiplied interconnect lines with other conductive features in memory...
US-7,361,559 Manufacturing method for a MOS transistor comprising layered relaxed and strained SiGe layers as a channel region
The invention includes non-volatile memory and logic devices associated with crystalline Si/Ge. The devices can include TFT constructions. The non-volatile...
US-7,361,234 Photolithographic stepper and/or scanner machines including cleaning devices and methods of cleaning...
Stepper and/or scanner machines including cleaning devices and methods for cleaning stepper and/or scanner machines are disclosed herein. In one embodiment, a...
US-7,361,152 Corrugated mattress vibrator longitudinally vibrated
A mattress vibrator comprises a mat having a hard plate and an elastic plate which are laminated on each other, and the mat is provided with a vibration...
US-7,361,078 Subpad support with releasable subpad securing element and polishing apparatus
A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad...
US-D567,217 Earphone
US-7,360,011 Memory hub and method for memory system performance monitoring
A memory module includes a memory hub coupled to several memory devices. The memory hub includes at least one performance counter that tracks one or more system...
US-7,360,006 Apparatus and method for managing voltage buses
The present technique relates to a method and apparatus for managing voltage buses. In a memory device, such as SRAM or DRAM, a periphery voltage bus may supply...
US-7,359,607 Waveguide for thermo optic device
A waveguide and resonator are formed on a lower cladding of a thermo optic device, each having a formation height that is substantially equal. Thereafter, the...
US-7,359,258 Semiconductor memory with wordline timing
A semiconductor memory with wordline timing, which links activating a wordline to an isolation signal. The isolation signal is applied to a memory section...
US-7,359,243 Memory cell repair using fuse programming method in a flash memory device
A method for repairing cells of a flash memory array includes using a fuse memory array circuit. The fuse memory cells are initially programmed. The locations of...
US-7,359,241 In-service reconfigurable DRAM and flash memory device
A memory cell that has both a DRAM cell and a non-volatile memory cell. The non-volatile memory cell might include a flash memory or an NROM cell. The memory...
US-7,358,872 Method and apparatus for converting parallel data to serial data in high speed applications
A method and apparatus to convert parallel data to serial data. More specifically, there is provided a parallel-to-serial converter comprising a data pipeline...
US-7,358,751 Contact pin assembly and contactor card
A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a...
US-7,358,596 Device isolation for semiconductor devices
Exemplary embodiments of the present invention disclose a semiconductor assembly having at least one isolation structure formed. The semiconductor assembly...
US-7,358,587 Semiconductor structures
In one aspect, the invention includes a method of forming a material within an opening, comprising: a) forming an etch-stop layer over a substrate, the etch-stop...
US-7,358,568 Low resistance semiconductor process and structures
A process for forming a semiconductor device comprises the steps of providing a semiconductor substrate assembly comprising a semiconductor wafer having an...
US-7,358,562 NROM flash memory devices on ultrathin silicon
An NROM flash memory cell is implemented in an ultra-thin silicon-on-insulator structure. In a planar device, the channel between the source/drain areas is...
US-7,358,561 Source lines for NAND memory devices
A NAND memory device has a source line connected to two or more columns of serially-connected floating-gate transistors. The source line includes a first...
US-7,358,554 Semiconductor manufacturing apparatus for modifying-in-film stress of thin films, and product formed thereby
An apparatus for depositing a thin film on a substrate and product produced thereby are disclosed. In particular, deposition of the thin film is carried out on...
US-7,358,553 System and method for reducing shorting in memory cells
An MRAM device includes an array of magnetic memory cells having an upper conductive layer and a lower conductive layer separated by a barrier layer. To reduce...
US-7,358,517 Method and apparatus for imager quality testing
An apparatus and method of detecting a defect in an imager die package. The method comprises the steps of exposing the imager die package to light at a first...
US-7,358,188 Method of forming conductive metal silicides by reaction of metal with silicon
The invention includes methods of forming conductive metal silicides by reaction of metal with silicon. In one implementation, such a method includes providing a...
US-7,358,185 Device having contact pad with a conductive layer and a conductive passivation layer
A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material...
US-7,358,178 Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film,...
Methods and apparatus for eliminating wire sweep and shorting while avoiding the use of under-bump metallization and high cost attendant to the use of...
US-7,358,171 Method to chemically remove metal impurities from polycide gate sidewalls
An embodiment includes a process of forming a gate stack that acts to resist the redeposition to the semiconductive substrate of mobilized metal such as from a...
US-7,358,170 Methods of forming conductive interconnects, and methods of depositing nickel
The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The...
US-7,358,161 Methods of forming transistor devices associated with semiconductor-on-insulator constructions
The invention encompasses a method of forming a semiconductor on-insulator construction. A substrate is provided. The substrate includes a ...
US-7,358,154 Method for fabricating packaged die
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The...
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