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Process and integration scheme for fabricating conductive components,
through-vias and semiconductor components...
A method for forming a conductive via in a semiconductor component is disclosed. The method includes providing a substrate having a first surface and an...
Double sided container process used during the manufacture of a
A method used during the formation of a semiconductor device comprises providing a wafer substrate assembly comprising a plurality of digit line plug contact...
The invention includes a method of forming a planarized surface over a semiconductor substrate. A substrate is provided which includes a memory array region and...
Semiconductor device comprising a crystalline layer containing
silicon/germanium, and comprising a silicon...
The invention includes non-volatile memory and logic devices associated with crystalline Si/Ge. The devices can include TFT constructions. The non-volatile...
Method and apparatus providing configurable current source device for
image sensors with a selective current at...
A configurable current source for imager readout system that can be operated as a simple-current-source or as a cascode-current-source. The configurable current...
Method of electroplating a substance over a semiconductor substrate
The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate...
Method to reduce charge buildup during high aspect ratio contact etch
A method of high aspect ratio contact etching a substantially vertical contact hole in an oxide layer using a hard photoresist mask is described. The oxide layer...
Stacked die in die BGA package
Semiconductor devices and stacked die assemblies, and methods of fabrication are provided. In various embodiments, the die assembly comprises a first die mounted...
Methods of forming transistors
The invention encompasses a method of incorporating nitrogen into a silicon-oxide-containing layer. The silicon-oxide-containing layer is exposed to a...
Structure for amorphous carbon based non-volatile memory
A memory device including at least one first memory element comprising a first layer of amorphous carbon over at least one second memory element comprising a...
Isolation regions for semiconductor devices and their formation
A hard mask layer is formed and patterned overlying a semiconductor substrate of a semiconductor device. The patterned hard mask layer exposes two or more areas...
Methods and apparatus with silicide on conductive structures
Exemplary embodiments of the invention provide pixel circuits having transistors with silicide on top of their gate stacks. In the exemplary embodiments,...
Integrated circuit device having reduced bow and method for making same
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of...
Die assembly and method for forming a die on a wafer
A method for forming a die on a wafer is provided. The method includes forming on a wafer a die having an active portion that includes integrated circuitry. The...
Methods and apparatus for processing microfeature workpieces; methods for
conditioning ALD reaction chambers
The present disclosure provides methods and apparatus that may be used to process microfeature workpieces, e.g., semiconductor wafers. Some aspects have...
Multi-functional solder and articles made therewith, such as
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the...
Reconfigurable memory module and method
A computer system includes a controller coupled to a plurality of memory modules each of which includes a memory hub and a plurality of memory devices divided...
System for testing semiconductor components
A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for...
Semiconductor integrated circuit package having electrically disconnected
solder balls for mounting
Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are...
Applying epitaxial silicon in disposable spacer flow
A process for forming active transistors for a semiconductor memory device by the steps of: forming transistor gates having generally vertical sidewalls in a...
Flash memory with recessed floating gate
A flash memory device where the floating gate of the flash memory is defined by a recessed access device. The use of a recessed access device results in a longer...
Analog vertical sub-sampling in an active pixel sensor (APS) image sensor
An active pixel sensor (APS) image sensor comprises an array of pixel circuits corresponding to rows and columns of pixels, a plurality of amplifiers that buffer...
Masking structure having multiple layers including amorphous carbon layer
A masking structure having multiple layers is formed. The masking structure includes an amorphous carbon layer and a cap layer formed over the amorphous carbon...
Methods of forming semiconductor constructions
The invention includes methods of forming semiconductor constructions in which a single etch is utilized to penetrate through a titanium-containing layer and...
Methods of forming metal-containing films over surfaces of semiconductor
The invention includes a method of forming a metal-containing film over a surface of a semiconductor substrate. The surface is exposed to a supercritical fluid....
Methods of forming low resistivity contact for an integrated circuit
Contact areas comprising doped semiconductor material at the bottom of contact holes are cleaned in a hot hydrogen plasma and exposed in situ during and/or...
Methods of forming semiconductor constructions
The invention includes methods of forming semiconductor constructions in which electrically conductive structures are formed between bitlines to electrically...
Method of manufacturing sidewall spacers on a memory device, and device
The present invention is generally directed to a method of manufacturing sidewall spacers on a memory device, and a memory device comprising such sidewall...
Semiconductor processing methods of forming integrated circuitry
Semiconductor processing methods of forming integrated circuitry are described. In one embodiment, memory circuitry and peripheral circuitry are formed over a...
Methods of packaging and testing microelectronic imaging devices
Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, a microelectronic imaging...
Methods and systems for planarizing workpieces, e.g., microelectronic
Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a...
Low power cost-effective ECC memory system and method
A memory controller couples 32-bit data words to and from a DRAM. The DRAM generates error checking and correcting syndromes to check and correct read data. The...
Sequential nibble burst ordering for data
A combination of circuits for use in a memory device is comprised of a decode circuit responsive to a first portion of address information for identifying a word...
Triggering of IO equilibrating ending signal with firing of column access
A method and apparatus for improving time between row address latching and column address latching (tRCD) by allowing the pull-up of the IO lines during a READ...
Method and apparatus for supplementary command bus
An electronic system according to various aspects of the present invention includes a memory having a location-specific command interface and a general command...
One transistor SOI non-volatile random access memory cell
Various semiconductor structure embodiments include a substrate, a buried insulator over at least a portion of the substrate, a body region over the buried...
Spintronic devices with integrated transistors
The semiconductor industry seeks to replace traditional volatile memory devices with improved non-volatile memory devices. The increased demand for a...
Stacked 1T-nmemory cell structure
This invention relates to memory technology and new variations on memory array architecture to incorporate certain advantages from both cross-point and 1T-1Cell...
Stacked columnar 1T-nMTJ MRAM structure and its method of formation and
This invention relates to an MRAM array architecture which incorporates certain advantages from both cross-point and 1T-1MTJ architectures during reading...
CMOS amplifiers with frequency compensating capacitors
The frequency and transient responses of a CMOS differential amplifier are improved by employing one or more compensating capacitors. A compensating capacitor...
Technique to improve the gain and signal to noise ratio in CMOS switched
The present invention comprises switched capacitor amplifiers including positive feedback on semiconductor devices, wafers, and systems incorporating same and...
Generating multi-phase clock signals using hierarchical delays
Circuits and methods for generating multi-phase clock signals using digitally-controlled hierarchical delay units (HDs) are provided. A plurality of...
Vertical NROM NAND flash memory array
Memory devices, arrays, and strings are described that facilitate the use of NROM memory cells in NAND architecture memory strings, arrays, and devices. NROM...
Non-planar flash memory array with shielded floating gates on silicon
A first plane of memory cells is formed on mesas of the array. A second plane of memory cells is formed in valleys adjacent to the mesas. The second plurality of...
High dynamic range image sensor
A pixel cell with controlled leakage is formed by modifying the location and gate profile of a high dynamic range (HDR) transistor. The HDR transistor may have a...
Capacitors having doped aluminum oxide dielectrics
Doped aluminum oxide layers having a porous aluminum oxide layer and methods of their fabrication. The porous aluminum oxide layer may be formed by evaporation...
Method of improving copper interconnects of semiconductor devices for
An improved wire bond is provided with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductive lead of a TAB tape...
Strapping word lines of NAND memory devices
Conductive straps are connected to a subset of word lines of a memory device. Alternatively, first conductive straps are respectively connected only to first...
Double-doped polysilicon floating gate
The present invention provides a method and apparatus for forming a double-doped polysilicon floating gate in a semiconductor memory element. The method includes...
Diode/superionic conductor/polymer memory structure
A conjugated polymer layer with a built-in diode is formed by providing a first metal-chalcogenide layer over a bottom electrode. Subsequently, a second...