Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching: micron





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-7,303,991 Atomic layer deposition methods
The invention includes an atomic layer deposition method of forming a layer of a deposited composition on a substrate. The method includes positioning a...
US-7,303,939 Electro- and electroless plating of metal in the manufacture of PCRAM devices
Non-volatile, resistance variable memory devices, integrated circuit elements, and methods of forming such devices are provided. According to one embodiment of a...
US-7,303,938 Gated isolation structure for imagers
Isolation methods and devices for isolating pixels of an image sensor pixel. The isolation structure and methods include forming a biased gate over a field...
US-7,303,931 Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces are disclosed herein. In one embodiment, a method for...
US-7,303,637 Method of cleaning semiconductor surfaces
Devices and methods of cleaning are described. The methods, and devices formed by the methods have a number of advantages. Embodiments are shown that include...
US-7,303,471 Method and system for transferring data to an electronic toy or other electronic device
A method for transferring data from a display device to an electronic device includes displaying a visual pattern on the display device. The visual pattern...
US-7,303,404 Contact and electrical connecting apparatus
A contact includes: a first and a second conductive contact pieces and at least one sheet-like electrical insulator such as polyimide. Each contact piece has a...
US-7,302,519 Distributed content addressable memory
The present invention provides a large capacity distributed content addressable memory (CAM) made up of a plurality of smaller CAMs interconnected on a high...
US-7,302,111 Graphics engine for high precision lithography
The present invention includes a method to use a phase modulating micromirror array to create an intensity image that has high image fidelity, good stability...
US-7,301,221 Controlling diffusion in doped semiconductor regions
A method and device for reducing a dopant diffusion rate in a doped semiconductor region is provided. The methods and devices include selecting a plurality of...
US-7,301,190 Structures and methods to enhance copper metallization
Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a...
US-7,300,873 Systems and methods for forming metal-containing layers using vapor deposition processes
A method of forming (and an apparatus for forming) a metal containing layer on a substrate, particularly a semiconductor substrate or substrate assembly for use...
US-7,300,870 Systems and methods of forming refractory metal nitride layers using organic amines
A method of forming (and apparatus for forming) refractory metal nitride layers (including silicon nitride layers), such as a tantalum nitride barrier layer, on...
US-7,300,857 Through-wafer interconnects for photoimager and memory wafers
A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making...
US-7,300,839 Selective polysilicon stud growth
A memory cell having a bit line contact is provided. The memory cell may be a 6F.sup.2 memory cell. The bit line contact may have a contact hole bounded by...
US-7,300,821 Integrated circuit cooling and insulating device and method
A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge...
US-7,300,526 Method and system for removal of contaminates from phaseshift photomasks
A system and method to clean the pellicle frame and adhesive ring of a photomask reticle are described. One embodiment includes a cover that isolates the...
US-7,299,381 Discrete tests for weak bits
A testing method for semiconductor memory that selects memory cells adjacent to the periphery of the memory array and to a memory twist. These memory cells are...
US-7,299,329 Dual edge command in DRAM
A technique to increase transfer rate of command and address signals via a given number of command and address pins in each of one or more integrated circuit...
US-7,298,638 Operating an electronic device having a vertical gain cell that includes vertical MOS transistors
A high density vertical gain cell is realized for memory operation. The gain cell includes a vertical MOS transistor used as a sense transistor having a floating...
US-7,298,453 Method and apparatus for irradiating a microlithographic substrate
A method and apparatus for exposing a radiation-sensitive material of a microlithographic substrate to a selected radiation. The method can include directing the...
US-7,298,425 Method for assisting video compression in a computer system
One embodiment of the present invention provides a method that facilitates compression of video data in a computer system by performing the time-consuming task...
US-7,298,406 Ground referenced pixel reset
A ground referenced pixel reset circuit is disclosed. The ground referenced pixel reset circuit supplies a pixel with a reset signal such that when the reset...
US-7,298,401 Method and apparatus for removing flicker from images
Method and apparatus for removing image artifacts from an image of a scene illuminated by a periodically varying light source such as a fluorescent light source....
US-7,298,031 Multiple substrate microelectronic devices and methods of manufacture
A microelectronic device and method for manufacture. In one embodiment, two microelectronic substrates are directly bonded to each other without an intermediate...
US-7,298,025 Microelectronic component assemblies and microelectronic component lead frame structures
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead...
US-7,298,024 Transparent amorphous carbon structure in semiconductor devices
A transparent amorphous carbon layer is formed. The transparent amorphous carbon layer has a low absorption coefficient such that the amorphous carbon is...
US-7,298,000 Conductive container structures having a dielectric cap
Container structures for use in integrated circuits and methods of their manufacture. The container structures have a dielectric cap on the top of a conductive...
US-7,297,995 Transparent metal shielded isolation for image sensors
An isolation region formed in a substrate and lined with a transparent metal layer. The isolation region provides isolation between adjacent active areas of an...
US-7,297,917 Readout technique for increasing or maintaining dynamic range in image sensors
The apparatus and method provide a readout technique and circuit for increasing or maintaining dynamic range of an image sensor. The readout technique and...
US-7,297,915 Compensation methods and systems for imaging detectors
Imaging arrays typically include thousands or millions of photodetectors that convert sensed light into corresponding electric signals, which are ultimately...
US-7,297,639 Methods for etching doped oxides in the manufacture of microfeature devices
Methods for selectively etching doped oxides in the manufacture of microfeature devices are disclosed herein. An embodiment of one such method for etching...
US-7,297,637 Use of pulsed grounding source in a plasma reactor
A method for grounding a semiconductor substrate pedestal during a portion of a high voltage power bias oscillation cycle to reduce or eliminate the detrimental...
US-7,297,623 Etch stop layer in poly-metal structures
In accordance with one embodiment of the present invention, a method of interfacing a poly-metal structure and a semiconductor substrate is provided where an...
US-7,297,617 Method for controlling diffusion in semiconductor regions
A method and device for reducing a dopant diffusion rate in a doped semiconductor region is provided. The methods and devices include selecting a plurality of...
US-7,297,563 Method of making contact pin card system
A compliant contact pin contactor card method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a...
US-7,297,412 Fabrication of stacked microelectronic devices
Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of...
US-7,296,346 Plating buss and a method of use thereof
The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly,...
US-7,295,462 Method and apparatus processing variable resistance memory cell write operation
A circuit and method for writing to a variable resistance memory cell. The circuit includes a variable resistance memory cell, a switchable current blocking...
US-7,295,081 Time delay oscillator for integrated circuits
One aspect relates to an oscillator, and various oscillator embodiments comprise an amplifier and line driver with an input and an output and a transmission line...
US-7,294,921 System-on-a-chip with multi-layered metallized through-hole interconnection
The present invention is directed to a high-performance system on a chip which uses multi-layer wiring/insulation through-hole interconnections to provide short...
US-7,294,911 Ultrathin leadframe BGA circuit package
A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while...
US-7,294,903 Transistor assemblies
Semiconductor processing methods of forming transistors, semiconductor processing methods of forming dynamic random access memory circuitry, and related...
US-7,294,897 Packaged microelectronic imagers and methods of packaging microelectronic imagers
Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in...
US-7,294,893 Titanium silicide boride gate electrode
A method for use in the fabrication of a gate electrode includes providing a gate oxide layer and forming a titanium boride layer on the oxide layer. An...
US-7,294,790 Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a...
Apparatus is provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in...
US-7,294,578 Use of a plasma source to form a layer during the formation of a semiconductor device
A method used to form a semiconductor device having a capacitor comprises placing a semiconductor wafer assembly into a chamber of a plasma source, the wafer...
US-7,294,570 Contact integration method
A method of making a contact plug and a metallization line structure is disclosed in which a substrate is provided with at least one contact hole within an...
US-7,294,567 Semiconductor contact device and method
The invention provides an advanced metallization technique for fabricating a memory cell array on a substrate. The array is fabricated by forming discrete and...
US-7,294,556 Method of forming trench isolation in the fabrication of integrated circuitry
This invention includes methods of forming a phosphorus doped silicon dioxide comprising layers, and methods of forming trench isolation in the fabrication of...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.