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Selective polysilicon stud growth
A memory cell having a bit line contact is provided. The memory cell may be a 6F.sup.2 memory cell. The bit line contact may have a contact hole bounded by...
Method of forming a memory cell
The invention relates to the fabrication of a resistance variable material cell or programmable metallization cell. The processes described herein can form a...
Method and apparatus for removing material from microfeature workpieces
Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having...
Method and apparatus for supporting a microelectronic substrate relative
to a planarization pad
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing...
Plasma reaction chamber liner consisting essentially of osmium
The invention encompasses a method of enhancing selectivity of etching silicon dioxide relative to one or more organic substances. A material comprising one or...
A multi-bank memory device includes rows and columns of memory cores. Each row includes memory cores from one bank interleaved with memory cores from another...
Method and apparatus for controlling refresh operations in a dynamic
A method and apparatus are provided for controlling refresh operations of a dynamic memory device. The temperature of the dynamic memory device is detected. The...
Circuits and methods of temperature compensation for refresh oscillator
A memory device has refresh cycles to refresh memory cells of the memory device. The time interval between one refresh cycle to the next refresh cycle is a...
Independent polling for multi-page programming
A method of testing, polling and trimming memory pages in different memory banks simultaneously is presented, using a cache memory located in each one of the...
Programming method for NAND EEPROM
A NAND architecture non-volatile memory device and programming process is described that programs the various cells of strings of non-volatile memory cells by...
In one aspect, the invention includes a method of forming a roughened layer of platinum, comprising: a) providing a substrate within a reaction chamber; b)...
Methods of forming contact openings, making electrical interconnections, and related integrated circuitry are described. Integrated circuitry formed through one...
Lead frame-based semiconductor device packages incorporating at least one
land grid array package
A lead frame-based semiconductor device package including at least one land grid array package. At least one semiconductor die is mounted to an interposer...
A silicon nitride comprising layer formed over a semiconductor substrate includes Al, Ga or a mixture thereof. A silicon dioxide comprising layer is formed...
Semiconductor processing methods of forming transistors, semiconductor processing methods of forming dynamic random access memory circuitry, and related...
Amplification with feedback capacitance for photodetector signals
Signals from an imager pixel photodetector are received by an amplifier having capacitive feedback, such as a capacitive transimpedance amplifier (CTIA). The...
Method of etching a substrate; method of forming a feature on a substrate;
and method of depositing a layer...
The invention includes methods of etching substrates, methods of forming features on substrates, and methods of depositing a layer comprising silicon, carbon and...
Methods of forming a reaction product and methods of forming a conductive
metal silicide by reaction of metal...
A method of forming a reaction product includes providing a semiconductor substrate comprising a first material. A second material is formed over the first...
Thin flip-chip method
Methods for thinning a bumped semiconductor wafer, as well as methods for producing flip-chips of very thin profiles, are disclosed. According to the methods of...
Methods of forming transistor constructions
The invention includes a non-volatile memory cell comprising a field effect transistor construction having a body region within a crystalline material. The body...
Radiation patterning tools, and methods of forming radiation patterning
The invention includes, for example, a radiation patterning tool which can be utilized to form relatively circular contacts in situations in which an array of...
Pattern generation on a semiconductor surface
A method of forming a pattern of elements is shown. In one embodiment, the method is used to create a reticle. In another embodiment, the method is used to...
Method for writing to multiple banks of a memory device
In a multi-bank memory system such as a synchronous dynamic random access memory (SDRAM), a method of writing data to the banks is provided. This method allows...
Reconstruction of signal timing in integrated circuits
Improved integrated circuits, memory devices, circuitry, and data methods are described that facilitate the adjustment and reconstruction of signal timing of...
Memory cell repair using fuse programming method in a flash memory device
A method for repairing cells of a flash memory array includes using a fuse memory array circuit. The fuse memory cells are initially programmed. The locations of...
Resistance variable memory element with threshold device and method of
forming the same
A memory device having a memory portion connected in series with a threshold device between. The memory portion stores at least one bit of data based on at least...
System and method for optically interconnecting memory devices
A memory device includes a semiconductor substrate in which memory circuitry has been fabricated. An address converter and a control signal converter are coupled...
Compliant contact pin test assembly and methods thereof
A compliant contact pin assembly and a contactor card and methods for testing therewith are provided. The compliant contact pin assembly includes a contact pin...
Method for testing using a universal wafer carrier for wafer level die
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer...
Stable PD-SOI devices and methods
One aspect of the present subject matter relates to a partially depleted silicon-on-insulator structure. The structure includes a well region formed above an...
Reverse metal process for creating a metal silicide transistor gate
The present invention teaches a method of forming a MOSFET transistor having a silicide gate which is not subject to problems produced by etching a metal...
Capacitor constructions with enhanced surface area
A capacitor fabrication method may include forming a first capacitor electrode over a substrate, the first electrode having an inner surface area per unit area...
The invention includes memory arrays, and methods which can be utilized for forming memory arrays. A patterned etch stop can be used during memory array...
Structure for amorphous carbon based non-volatile memory
A memory device including at least one first memory element comprising a first layer of amorphous carbon over at least one second memory element comprising a...
Microelectronic imaging devices and associated methods for attaching
Microelectronic imaging devices and associated methods for attaching transmissive elements are disclosed. A manufacturing method in accordance with one...
Method for two-stage transfer molding device to encapsulate MMC module
A method for fabricating a semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor...
Molded stiffener for thin substrates
A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is...
Electret capacitor microphone and method for producing the same
A method for producing an electret capacitor microphone high in sensitivity and stable in acoustic characteristic. A PET film stretched with predetermined...
Methods of forming a contact pin assembly
A compliant contact pin assembly method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate...
Capacitive multidrop bus compensation
The signal integrity of a high speed heavily loaded multidrop memory bus is often degraded due the numerous impedance mismatches. The impedance mismatches causes...
Offset compensated sensing for magnetic random access memory
An offset compensated memory element voltage supply including a differential amplifier with a compensation circuit, and a transistor with a gate connected to the...
Low power dissipation voltage generator
A voltage generator circuit is described for providing a regulated voltage, such as a negative word line voltage in a semiconductor memory. The generator uses a...
Serial transistor-cell array architecture
A memory device having memory cells in which a single access transistor controls the grounding of at least four storage elements, such as resistive storage...
CMOS image sensor with a low-power architecture
A system of reducing power consumption in and active pixels sensor. The sensor is broken into different blocks, and each of the blocks is individually optimized....
High speed, low power CMOS logic gate
A logic gate with a differential evaluation stage, precharge circuitry for precharging outputs of the gate, latch circuitry for latching the outputs and an...
Apparatus and method for independent control of on-die termination for
output buffers of a memory device
An apparatus and method providing independent control of on-die termination (ODT) of output buffers. The ODTs for the buffer circuits of an input/output (I/O)...
Integrated circuit (IC) test assembly including phase change material for
stabilizing temperature during stress...
A testing apparatus and method for testing integrated circuits is disclosed wherein a device under test is continuously maintained at a desired set point...
Load board socket adapter and interface method
A load board adapter which is removably attachable to a load board and provides removable and replaceable sockets for individual integrated circuit packages to...
Support elements for semiconductor devices with peripherally located bond
A support structure for a semiconductor device with peripherally disposed contacts includes a support substrate and at least one conductive column protruding...
Coating of copper and silver air bridge structures to improve
electromigration resistance and other applications
An improved electrical interconnect for an integrated circuit and methods for providing the same are disclosed. The electrical interconnect includes an air...