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Patent # | Description |
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US-7,396,720 |
High coupling memory cell A first dielectric layer is formed over a substrate. A single layer first conductive layer that acts as a floating gate is formed over the first dielectric... |
US-7,396,702 |
Module assembly and method for stacked BGA packages Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array... |
US-7,396,699 |
Method of forming non-volatile resistance variable devices and method of
forming a programmable memory cell of... A first conductive electrode material is formed on a substrate. Chalcogenide comprising material is formed thereover. The chalcogenide material comprises... |
US-7,396,570 |
Plasma enhanced chemical vapor deposition method of forming titanium
silicide comprising layers Chemical vapor deposition methods of forming titanium silicide including layers on substrates are disclosed. TiCl.sub.4 and at least one silane are first fed to... |
US-7,396,447 |
Through-hole conductors for semiconductor substrates and system for making
same A method, structure and system for forming a through-hole conductor in a semiconductor substrate includes forming a hole having an inner surface from a first... |
US-7,395,409 |
Split embedded DRAM processor A processing architecture includes a first CPU core portion coupled to a second embedded dynamic random access memory (DRAM) portion. These architectural... |
US-7,395,130 |
Method and system for aggregating and combining manufacturing data for
analysis A method and system for aggregating and combining manufacturing data for analysis for the purposes of increasing manufacturing efficiency and reducing... |
US-7,394,699 |
Sense amplifier for a non-volatile memory device The memory device has a plurality of memory cells each coupled to a bitline. A feedback transistor is coupled to the bitline and provides voltage feedback on the... |
US-7,394,693 |
Multiple select gate architecture Non-volatile memory devices including multiple series-coupled select gates on the drain and/or source ends of strings of non-volatile memory cells. By utilizing... |
US-7,394,267 |
Compliant contact pin assembly and card system A compliant contact pin assembly and a contactor card system are provided. The compliant contact pin assembly includes a contact pin formed from a portion of a... |
US-7,394,157 |
Integrated circuit and seed layers Structures are provided which improve performance in integrated circuits. The structures include a diffusion barrier and a seed layer in an integrated circuit... |
US-7,394,142 |
Bulk-isolated PN diode and method of forming a bulk-isolated PN diode A technique for making a bulk isolated PN diode. Specifically, a technique is provided for making a voltage clamp with a pair of bulk isolated PN diode. Another... |
US-7,394,111 |
Strained Si/SiGe structures by ion implantation One aspect of this disclosure relates to a method for forming a strained silicon over silicon germanium (Si/SiGe) structure. In various embodiments, germanium... |
US-7,394,056 |
Image sensor having pinned floating diffusion diode The present invention provides an image sensor having a pinned floating diffusion region in addition to a pinned photodiode. The pinned floating diffusion region... |
US-7,393,798 |
Resistance variable memory with temperature tolerant materials A PCRAM memory device having a chalcogenide glass layer, preferably comprising antimony selenide having a stoichometric formula of about Sb.sub.2Se.sub.3, and a... |
US-7,393,796 |
Composite dielectric forming methods and composite dielectrics A composite dielectric forming method includes atomic layer depositing alternate layers of hafnium oxide and lanthanum oxide over a substrate. The hafnium oxide... |
US-7,393,789 |
Protective coating for planarization Various pattern transfer and etching steps can be used to create features. Conventional photolithography steps can be used in combination with pitch-reduction... |
US-7,393,785 |
Methods and apparatus for forming rhodium-containing layers A method of forming a rhodium-containing layer on a substrate, such as a semiconductor wafer, using complexes of the formula L.sub.yRhY.sub.z is provided. Also... |
US-7,393,783 |
Methods of forming metal-containing structures The invention includes methods of forming metal-containing layers. The layers can, in particular aspects, consist essentially of metal, or consist of metal. The... |
US-7,393,770 |
Backside method for fabricating semiconductor components with conductive
interconnects A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a... |
US-7,393,753 |
Method for forming a storage cell capacitor compatible with high
dielectric constant materials Described are integrated circuit electrodes and method for fabricating an electrode, which include, in an embodiment forming a silicon, first portion of the... |
US-7,393,743 |
Methods of forming a plurality of capacitors The invention includes methods of forming a plurality of capacitors. In one implementation, a plurality of capacitor electrode openings is formed over a... |
US-7,393,741 |
Methods of forming pluralities of capacitors The invention comprises methods of forming pluralities of capacitors. In one implementation, metal is formed over individual capacitor storage node locations on... |
US-7,393,736 |
Atomic layer deposition of Zr.sub.x Hf.sub.y Sn.sub.1-x-y O.sub.2 films as
high k gate dielectrics The use of atomic layer deposition (ALD) to form a nanolaminate dielectric of zirconium oxide (ZrO.sub.2), hafnium oxide (HfO.sub.2) and tin oxide (SnO.sub.2)... |
US-7,393,563 |
Plasma enhanced chemical vapor deposition method of forming titanium
silicide comprising layers Chemical vapor deposition methods of forming titanium suicide including layers on substrates are disclosed. TiCl.sub.4 and at least one silane are first fed to... |
US-7,393,562 |
Deposition methods for improved delivery of metastable species A method of providing material into a deposition chamber is provided. A reservoir is in fluid communication with the deposition chamber. A metastable specie is... |
US-7,392,731 |
Paper cutter In a force cutting type paper cutter, a movable blade includes a pair of right and left edges having a V shape. These right and left edges are intersected and... |
US-7,392,584 |
Methods and apparatus for a flexible circuit interposer Methods and apparatus for testing a semiconductor device are disclosed. A flexible circuit interposer includes a flexible circuit substrate which allows in-situ... |
US-7,392,436 |
Program failure recovery A method of operating a memory device when a program failure occurs is provided. The method includes preserving first data within the memory device and... |
US-7,392,331 |
System and method for transmitting data packets in a computer system
having a memory hub architecture A system and method for transmitting data packets from a memory hub to a memory controller is disclosed. The system includes an upstream reception port coupled... |
US-7,392,274 |
Multi-function floating point arithmetic pipeline A scalable engine having multiple datapaths, each of which is a unique multi-function floating point pipeline capable of performing a four component dot product... |
US-7,391,904 |
Correlation-based color mosaic interpolation adjustment using luminance
gradients Processing a digitized image signal includes selectively adjusting interpolated color values on the basis of correlations between pre-identified reference... |
US-7,391,666 |
DRAM power bus control A dynamic random access memory (DRAM) is provided that has separate array and peripheral power busing to isolate array noise from peripheral circuits such as... |
US-7,391,654 |
Memory block erasing in a flash memory device The erase and verify method performs an erase operation and an erase verify read operation. If the erase verify read operation fails because unerased memory... |
US-7,391,648 |
Low voltage sense amplifier for operation under a reduced bit line bias
voltage A regulated charge pump, regulated by a plurality of capacitor boost stages and separate from the memory device supply voltage (V.sub.cc), generates a regulated... |
US-7,391,637 |
Semiconductor memory device with high permeability composite films to
reduce noise in high speed interconnects A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation... |
US-7,391,466 |
Camera module with dust trap A camera module for capturing an image. The camera module including an image sensor including a die mounted on a substrate, a housing coupled with the substrate... |
US-7,391,243 |
Low power and low timing jitter phase-lock loop and method A phase-lock loop generates an output clock signal from an input clock signal. The output clock signal is coupled through a clock tree and is fed back to a phase... |
US-7,391,117 |
Method for fabricating semiconductor components with conductive spring
contacts An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage... |
US-7,391,072 |
Programmable array logic or memory with p-channel devices and asymmetrical
tunnel barriers Structures and methods for programmable array type logic and/or memory with p-channel devices and asymmetrical low tunnel barrier intergate insulators are... |
US-7,391,070 |
Semiconductor structures and memory device constructions The invention includes a semiconductor structure having a gateline lattice surrounding vertical source/drain regions. In some aspects, the source/drain regions... |
US-7,391,066 |
Imager floating diffusion region and process for forming same The present invention provides an imager device with a floating diffusion region resistant to charge leakage. The floating diffusion region is formed having a... |
US-7,391,008 |
Method and system for wavelength-dependent imaging and detection using a
hybrid filter Apparatus and methods for wavelength-dependent detection are provided. A detector includes a hybrid filter having unpatterned and patterned filter layers and at... |
US-7,390,756 |
Atomic layer deposited zirconium silicon oxide films A dielectric layer containing an atomic layer deposited zirconium silicon oxide film disposed in an integrated circuit and a method of fabricating such a... |
US-7,390,746 |
Multiple deposition for integration of spacers in pitch multiplication
process Pitch multiplication is performed using a two step process to deposit spacer material on mandrels. The precursors of the first step react minimally with the... |
US-7,390,740 |
Sloped vias in a substrate, spring-like contacts, and methods of making Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed... |
US-7,390,738 |
Fabrication of semiconductor devices using anti-reflective coatings Techniques are disclosed for fabricating a device using a photolithographic process. The method includes providing a first anti-reflective coating over a surface... |
US-7,390,712 |
Methods of enhancing capacitors in integrated circuits Systems, devices, structures, and methods are described that inhibit dielectric degradation at high temperatures. An enhanced capacitor is discussed. The... |
US-7,390,710 |
Protection of tunnel dielectric using epitaxial silicon Layers of epitaxial silicon are used to protect the tunnel dielectric layer of a floating-gate memory cell from excessive oxidation or removal during the... |
US-7,390,690 |
Imager light shield An improved imager pixel arrangement having a light shield over the pixel circuitry, but below the conductive interconnect layers of the pixel. The light shield... |