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Patent # Description
US-7,329,949 Packaged microelectronic devices and methods for packaging microelectronic devices
Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a ...
US-7,329,945 Flip-chip adaptor package for bare die
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or...
US-7,329,943 Microelectronic devices and methods for forming interconnects in microelectronic devices
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In...
US-7,329,924 Integrated circuits and methods of forming a field effect transistor
Integrated circuits and methods of forming field effect transistors are disclosed. In one aspect, an integrated circuit includes a semiconductor substrate...
US-7,329,920 Trench corner effect bidirectional flash memory cell
A non-volatile memory cell structure that is capable of holding two data bits. The structure includes a trench in a substrate with two sides of the trench being...
US-7,329,917 Permeable capacitor electrode
The present teachings describe a container capacitor that utilizes an etchant permeable lower electrode for the formation of single or double-sided capacitors...
US-7,329,910 Semiconductor substrates and field effect transistor constructions
The invention includes methods of forming field effect transistor gates. In one implementation, a series of layers is formed proximate a semiconductive material...
US-7,329,899 Wafer-level redistribution circuit
A semiconductor component configured for wafer-level testing includes a semiconductor die having at least one die contact electrically exposed for coupling with...
US-7,329,861 Integrally packaged imaging module
An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level...
US-7,329,856 Image sensor having integrated infrared-filtering optical device and related method
An image sensing device is disclosed having a die formed with an array of photosensing sites and a structure of optical material having infrared absorbing...
US-7,329,618 Ion implanting methods
An ion implanting method includes forming a pair of spaced and adjacent features projecting outwardly from a substrate. At least outermost portions of the pair...
US-7,329,615 Atomic layer deposition method of forming an oxide comprising layer on a substrate
This invention includes atomic layer deposition methods of depositing oxide comprising layers on substrates. In one implementation, a substrate is positioned...
US-7,329,607 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
A conductive connection forming method includes forming a first layer comprising a first metal on a substrate and forming a second layer comprising a second...
US-7,329,576 Double-sided container capacitors using a sacrificial layer
Double-sided container capacitors are formed using sacrificial layers. A sacrificial layer is formed within a recess in a structural layer. A lower electrode is...
US-7,329,573 Methods of forming capacitors
A method of forming a capacitor includes forming a first capacitor electrode over a semiconductor substrate. A capacitor dielectric region is formed onto the...
US-7,329,558 Differential negative resistance memory
The invention relates to a DNR (differential negative resistance) exhibiting device that can be programmed to store information as readable current amplitudes...
US-7,329,552 Field effect transistor fabrication methods, field emission device fabrication methods, and field emission...
The present invention includes field effect transistors, field emission apparatuses, thin film transistors, and methods of forming field effect transistors....
US-7,329,292 Process byproduct trap and system including same
A trap device including at least one substance delivery element for introducing a substance therein is disclosed. The delivered substance may influence the...
US-7,329,168 Extended Kalman filter incorporating offline metrology
An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter...
US-7,328,517 Method and apparatus for measurement of thickness and warpage of substrates
An apparatus comprises one or more pairs of mutually coaxial and opposing linear measuring devices including movable, biased fingers for simultaneously...
US-RE40,061 Multi-chip stacked devices
A multiple stacked die device is disclosed that contains up to four dies and does not exceed the height of current single die packages. Close-tolerance stacking...
US-7,328,425 Method and device for correcting SLM stamp image imperfections
The invention relates to production and precision patterning of work pieces, including manufacture of photomask for photolithography and direct writing on other...
US-7,328,381 Testing system and method for memory modules having a memory hub architecture
A testing method and system is used to test memory modules each of which has a memory hub coupled to a plurality of memory devices. The testing system and method...
US-7,328,379 Look-up table for use with redundant memory
A redundancy scheme for a memory is disclosed that is programmable both before and after the memory device is packaged and/or installed in a system. This is...
US-7,327,629 Circuit and method for reading an antifuse
An antifuse circuit and antifuse reading method for determining whether an antifuse is programmed or un-programmed. An antifuse circuit includes a sensing...
US-7,327,628 Circuit and method for reading an antifuse
An antifuse circuit and antifuse reading method for determining whether an antifuse is programmed or un-programmed. An antifuse circuit includes a sensing...
US-7,327,618 Semiconductor memory with wordline timing
A semiconductor memory with wordline timing, which links activating a wordline to an isolation signal. The isolation signal is applied to a memory section...
US-7,327,592 Self-identifying stacked die semiconductor components
A semiconductor die having a functional circuit (e.g., a memory array) and a decode circuit suitable for use in a stacked die semiconductor component (e.g., a...
US-7,327,393 CMOS image sensor with variable conversion gain
An image sensor pixel has variable conversion gain to prevent overexposure of the pixel without reducing the exposure period. Under dim lighting conditions, the...
US-7,327,263 Communications system and method with A/D converter
A communications system includes a radio frequency identification device including an integrated circuit having a single die including a microprocessor, a...
US-7,327,173 Delay-locked loop having a pre-shift phase detector
A clock generator for generating an output clock signal synchronized with an input clock signal having first and second adjustable delay lines. The first...
US-7,327,034 Compositions for planarization of metal-containing surfaces using halogens and halide salts
A planarization method includes providing a metal-containing surface (preferably, a Group VIII metal-containing surface, and more preferably a ...
US-7,327,016 High permeability composite films to reduce noise in high speed interconnects
An electronic system is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation...
US-7,326,984 MIS capacitor and method of formation
An MIS capacitor with low leakage and high capacitance is disclosed. A layer of hemispherical grained polysilicon (HSG) is formed as a lower electrode. Prior to...
US-7,326,980 Devices with HfSiON dielectric films which are Hf-O rich
A dielectric film containing atomic layer deposited HfSiON and a method of fabricating such a dielectric film produce a reliable dielectric layer having an...
US-7,326,960 Semiconductor circuit constructions
The invention includes a method of forming semiconductor circuitry wherein a first semiconductor structure comprising a first monocrystalline semiconductor...
US-7,326,950 Memory device with switching glass layer
A memory device, such as a PCRAM, including a chalcogenide glass backbone material with germanium telluride glass and methods of forming such a memory device.
US-7,326,904 In-pixel kTC noise suppression using circuit techniques
A circuit and method for reducing kTC noise in CMOS imagers while minimizing power dissipation is disclosed. Correlated double sampling (CDS) is performed within...
US-7,326,647 Dry etching process to form a conductive layer within an opening without use of a mask during the formation of...
A method for use in fabrication of a semiconductor device comprises forming a conformal conductive layer over a planarized surface of a dielectric layer, and...
US-7,326,611 DRAM arrays, vertical transistor structures and methods of forming transistor structures and DRAM arrays
The invention includes a method of forming a semiconductor construction. Dopant is implanted into the upper surface of a monocrystalline silicon substrate. The...
US-7,326,607 Imager floating diffusion region and process for forming same
The present invention provides an imager device with a floating diffusion region resistant to charge leakage. The floating diffusion region is formed having a...
US-7,326,606 Semiconductor processing methods
In one aspect, the invention provides a method of forming a contact opening to a conductive line. In one preferred implementation, a contact opening is formed to...
US-7,326,597 Gettering using voids formed by surface transformation
One aspect of this disclosure relates to a method for creating a gettering site in a semiconductor wafer. In various embodiments, a predetermined arrangement of...
US-7,326,591 Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods...
Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed...
US-7,326,503 Process for color filter array residual pigment removal
A method of fabricating a color filter array including the removal of unwanted residual color pigments. A substrate is coated with a colored photoresist layer....
US-7,326,316 Electrical interconnect using locally conductive adhesive
An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at feast one...
US-7,326,105 Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device...
Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head...
US-7,326,066 Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same
An adapter and method for aligning and connecting the external leads of at least one integrated circuit device to conductors on a substrate of a multi-chip...
US-7,325,089 Controller for refreshing memories
A memory utilizes a data refresh algorithm to preserve data integrity over disturbances caused by memory programming or erase operations. The memory device...
US-7,324,690 Metal mask for light intensity determination and ADC calibration
An apparatus and method for controlling gain characteristics in a CMOS imager and for calibrating light intensity and analog to digital conversion in a pixel...
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