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Etch stop layer in poly-metal structures
In accordance with one embodiment of the present invention, a method of forming an etch stop layer in a semiconductor structure is provided. A polysilicon layer...
Method for protecting against oxidation of a conductive layer in said
In a semiconductor device including a first conductive layer, the first conductive layer is treated with a nitrogen/hydrogen plasma before an additional layer is...
Method of forming a conductive line
A method of forming a conductive line includes forming conductive material received over a semiconductor substrate into a line having opposing sidewalls....
Methods for designing bond pad rerouting elements for use in stacked
semiconductor device assemblies and for...
A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The...
Underfill compounds including electrically charged filler elements,
microelectronic devices having underfill...
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler...
Methods for marking a packaged semiconductor die including applying tape
and subsequently marking the tape
The present invention provides a method and apparatus for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers...
Microelectronic substrate having conductive material with blunt cornered
apertures, and associated methods for...
A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate...
Electrical contacts with dielectric cores
An electrical contact for use with a semiconductor device, a carrier, a probe card, or another substrate includes a dielectric core and a conductive coating on...
Apparatus for forming modular sockets using flexible interconnects and
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a...
Device for establishing non-permanent electrical connection between an
integrated circuit device lead element...
A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact...
Mold assembly for a package stack via bottom-leaded plastic (BLP)
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of...
Printed circuit board support
A printed circuit board conveying system is provided comprising a printed circuit board conveyor and a printed circuit board support. The printed circuit board...
Apparatus for deforming resilient contact structures on semiconductor
A method for testing and burning-in semiconductor components such as semiconductor dice on a semiconductor wafer, is provided. The method includes the step of...
Method for PECVD deposition of selected material films
A process for PECVD of selected material films on a substrate comprising the steps of placing a substrate in a PECVD chamber and maintaining the chamber under...
Method for fabricating an interposer
An interposer including a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, with an interposer substrate. The...
Methods of forming patterned reticles
The invention includes methods of forming patterned reticles. Design features can be introduced into a layout for a reticle prior to optical proximity...
Synchronous flash memory with test code input
A synchronous non-volatile memory device has address input connections and data input/output connections. A test operation can be initiated that use signals...
Multi-drive virtual mass storage device and method of operating same
A virtual mass storage device implements a data manager for storing information on multiple physical mass storage devices. The virtual mass storage device is...
Double data rate scheme for data output
Systems, devices, and methods for a double data rate memory device includes a storage element, a first pipeline, and a second pipeline. The pipelines are...
Cache management system
A processing system optimized for data string manipulations includes data string execution circuitry associated with a bus interface unit or memory controller....
Method for bus capacitance reduction
Data bus capacitance is reduced by decoupling unaccessed memory circuits from a data bus during data transfers to or from other memory circuits.
Flash memory data bus for synchronous burst read page
Memory device is described that utilizes a reduced number of sense amplifiers to sense the data bits of a selected column page. The sense amplifiers are...
Pre-emphasis for strobe signals in memory device
A memory device has a number of data terminals for transferring data signals and a number of strobe terminals for transferring strobe signals representing timing...
State save-on-power-down using GMR non-volatile elements
The semiconductor industry seeks to reduce the risk of traditional volatile storage devices with improved non-volatile storage devices. The increased demand for...
CAM memory architecture and a method of forming and operating a device
according to a CAM memory architecture
A method for operating a content addressable memory that includes receiving a first data value for evaluation at a first memory block during a first time...
DRAM cells and electronic systems
The invention includes capacitor constructions which have a layer of aluminum oxide between a high-k dielectric material and a layer containing titanium and...
Capacitor electrode having an interface layer of different chemical
composition formed on a bulk layer
An improved capacitor that is less susceptible to the depletion effect and methods for providing the same. The capacitor comprises a first and second electrode...
Frame shuttering scheme for increased frame rate
A frame shutter apparatus comprising a controller for controlling multiple groups of pixels and for reading out values corresponding to the charge collected by...
Interrogators, methods of operating a coherent interrogator, backscatter
communication methods, interrogation...
The present invention includes phase shifters, interrogators, methods of shifting a phase angle of a signal, and methods of operating an interrogator. One aspect...
Field emission tips, arrays, and devices
A method for fabricating field emitters from a conductive or semiconductive substrate. A layer of low work function material may be formed on the substrate....
Semiconductor device, ball grid array connection system, and method of
A semiconductor device is provided with a metal stiffening layer between the die and a multilayer structure comprising at least two insulating layers each having...
Multilevel copper interconnects with low-k dielectrics and air gaps
Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a...
Semiconductor package assembly and method for electrically isolating
A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The package...
Open pattern inductor
The invention includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality of...
Programmable memory devices supported by semiconductor substrates
The invention includes a memory device supported by a semiconductor substrate and comprising in ascending order from the substrate: a floating gate, a dielectric...
Isolation process and structure for CMOS imagers
A barrier implanted region of a first conductivity type located below an isolation region of a pixel sensor cell and spaced from a doped region of a second...
High dynamic range pixel amplifier
A pixel cell with increased dynamic range is formed by providing a floating diffusion region having a variable capacitance, controlled by at least one gate...
In one aspect, the invention encompasses a method of treating the end portions of an array of substantially upright silicon-comprising structures. A substrate...
Apparatus and method for pixel binning in an image sensor
Embodiments provide structures and methods for binning pixel signals of a pixel array. Pixel signals for pixels in an element of the array are binned...
Method of forming integrated circuit structures in silicone ladder polymer
A method of forming integrated circuit structures, such as capacitors and conductive plugs, within contact openings formed in a photosensitive silicone ladder...
Methods for forming vias in microelectronic devices, and methods for
packaging microelectronic devices
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and...
Methods of forming semiconductor constructions
The invention includes a semiconductor construction having a pair of channel regions that have sub-regions doped with indium and surrounded by boron. A pair of...
Method of forming a device
A method of forming a device is disclosed. The method includes forming a capacitor, and forming the capacitor includes forming a first electrode. The first...
Optimized flash memory cell
A flash memory comprising floating gate devices being connected to one-another through their source electrodes being self-aligned to their respective gate...
Reduced cell-to-cell shorting for memory arrays
Bottom electrodes of memory cell capacitors are recessed to prevent electrical shorts between neighboring memory cells. A partially fabricated memory cell...
Current limiting antifuse programming path
Method and apparatus are disclosed for regulating an antifuse programming current by lightly doping an electrically connected region so that the resistance of...
Method of making a center bond flip chip semiconductor carrier
A center bond flip chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a plurality of...
Method and apparatus for attaching microelectronic substrates and support
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first...
Method of forming a stack of packaged memory dice
A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board...
Circuit and substrate encapsulation methods
A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the...