Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching: micron





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-7,098,475 Apparatuses configured to engage a conductive pad
A method of engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof includes: a)...
US-7,098,128 Method for filling electrically different features
Methods of electroless filling electrically different features such as contact openings to form interconnects and conductive contacts, and semiconductor devices,...
US-7,098,122 Method of fabricating a vertically integrated memory cell
A unique cell structure for use in flash memory cell and a method of fabricating the memory cell. More particularly, a vertically integrated transistor having a...
US-7,098,105 Methods for forming semiconductor structures
The invention includes a semiconductor structure having a gateline lattice surrounding vertical source/drain regions. In some aspects, the source/drain regions...
US-7,098,068 Method of forming a chalcogenide material containing device
Embodiments of the invention provide a method of forming a chalcogenide material containing device, and particularly resistance variable memory elements. A stack...
US-7,097,782 Method of exposing a substrate to a surface microwave plasma, etching method, deposition method, surface...
In certain implementations, methods and apparatus include an antenna assembly having at least two overlapping and movable surface microwave plasma antennas. The...
US-7,097,546 System and method for reducing surface defects in integrated circuits
The fabrication of integrated circuits entails the repeated application of many basic processing steps, for instance, planarization--the process of making a...
US-7,097,526 Method of forming nitrogen and phosphorus doped amorphous silicon as resistor for field emission display device...
Described herein is a resistor layer for use in field emission display devices and the like, and its method of manufacture. The resistor layer is an amorphous...
US-7,097,373 Printer
A printer including a cutting portion including a plate-shaped fixed blade, a plate-shaped movable blade and a driving unit, which drives the movable blade back...
US-7,096,452 Method and device for checking lithography data
Devices and methods are provided that include advantages such as the ability to identify sizes, shapes and locations of frequently unwanted additional features...
US-7,096,446 Hierarchical semiconductor design
Hierarchical semiconductor structure design is disclosed. One aspect of the invention is a computerized system that includes a semiconductor structure (such as a...
US-7,096,370 Data security for digital data storage
A computer system encrypts user generated data with an encryption process, wherein the encryption process is defined at least in part with information assigned...
US-7,096,304 Apparatus and method for managing voltage buses
The present technique relates to a method and apparatus for managing voltage buses. In a memory device, such as SRAM or DRAM, a periphery voltage bus may supply...
US-7,096,283 Synchronous flash memory with status burst output
A synchronous flash memory includes an array of non-volatile memory cells. The memory array is arranged in rows and columns, and can be further arranged in...
US-7,095,885 Method for measuring registration of overlapping material layers of an integrated circuit
A method and apparatus for measuring registration between two or more integrated circuit layers is disclosed. Images of actual operative circuitry of different...
US-7,095,667 Noise resistant small signal sensing circuit for a memory device
Apparatus and method for data sensing circuitry that uses averaging to sense small differences in signal levels representing data states. The apparatus...
US-7,095,660 Sending signal through integrated circuit during setup time
A memory device includes a control circuit for initiating a read operation and a write operation in response to a combination of input signals during a setup...
US-7,095,658 Flash memory data bus for synchronous burst read page
Memory device is described that utilizes a reduced number of sense amplifiers to sense the data bits of a selected column page. The sense amplifiers are...
US-7,095,653 Common wordline flash array architecture
The memory area on a die required for row (X) and column (Y) decoders is reduced by a plurality of memory array blocks sharing wordlines to a single row decoder....
US-7,095,440 Photodiode-type pixel for global electronic shutter and reduced lag
Operation for global electronic shutter photodiode-type pixels. In a first mode of operation, lag is reduced through global reset of the photodiode array and...
US-7,095,261 Clock capture in clock synchronization circuitry
Clock capturing synchronization circuitry first generates a synchronized clock signal from a reference clock signal, then captures the synchronized clock signal,...
US-7,095,242 In-tray burn-in board, device and test assembly for testing integrated circuit devices in situ on processing trays
A burn-in board for burn-in and electrical testing of a plurality of integrated circuit devices that are disposed in one or more processing trays may include a...
US-7,095,122 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one...
US-7,095,115 Circuit substrates, semiconductor packages, and ball grid arrays
In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and...
US-7,095,106 Collars, support structures, and forms for protruding conductive structures
Collars, support structures, or forms for protruding conductive structures include apertures or receptacles through which the conductive structure may extend....
US-7,095,097 Integrated circuit device having reduced bow and method for making same
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of...
US-7,095,095 Semiconductor constructions
The invention includes a semiconductor construction. The construction has a semiconductor material die with a front surface, a back surface in opposing relation...
US-7,095,088 System and device including a barrier layer
Systems and devices are disclosed utilizing a silicon-containing barrier layer. A semiconductor device is disclosed and includes a substrate, a gate oxide, a...
US-7,095,083 Methods for making semiconductor structures having high-speed areas and high-density areas
Methods for making a semiconductor structure are discussed. The methods include forming openings in a high-density area and a high-speed area, and forming a...
US-7,095,075 Apparatus and method for split transistor memory having improved endurance
The present invention includes floating gate transistor structures used in non-volatile memory devices such as flash memory devices. In one embodiment, a system...
US-7,094,700 Plasma etching methods and methods of forming memory devices comprising a chalcogenide comprising layer...
In one implementation, a plasma etching method comprises forming a Ge.sub.xSe.sub.y chalcogenide comprising layer over a substrate. A mask comprising an organic...
US-7,094,699 Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor...
A method used to fabricate a semiconductor device comprises etching a dielectric which results in an undesirable charge buildup along a sidewall formed in the...
US-7,094,695 Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
Conditioning apparatuses and methods for conditioning polishing pads used for mechanical and/or chemical-mechanical planarization of micro-device workpieces are...
US-7,094,690 Deposition methods and apparatuses providing surface activation
A deposition method includes, at a first temperature, contacting a substrate with a surface activation agent and adsorbing a first layer over the substrate. At a...
US-7,094,682 Coating of copper and silver air bridge structures to improve electromigration resistance and other applications
An improved electrical interconnect for an integrated circuit and methods for providing the same are disclosed. The electrical interconnect includes an air...
US-7,094,673 Etch stop layer in poly-metal structures
In accordance with one embodiment of the present invention, a method of forming an etch stop layer in a semiconductor structure is provided. A polysilicon layer...
US-7,094,657 Method for protecting against oxidation of a conductive layer in said device
In a semiconductor device including a first conductive layer, the first conductive layer is treated with a nitrogen/hydrogen plasma before an additional layer is...
US-7,094,636 Method of forming a conductive line
A method of forming a conductive line includes forming conductive material received over a semiconductor substrate into a line having opposing sidewalls....
US-7,094,631 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for...
A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The...
US-7,094,628 Underfill compounds including electrically charged filler elements, microelectronic devices having underfill...
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler...
US-7,094,618 Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape
The present invention provides a method and apparatus for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers...
US-7,094,131 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for...
A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate...
US-7,094,117 Electrical contacts with dielectric cores
An electrical contact for use with a semiconductor device, a carrier, a probe card, or another substrate includes a dielectric core and a conductive coating on...
US-7,094,108 Apparatus for forming modular sockets using flexible interconnects and resulting structures
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a...
US-7,094,065 Device for establishing non-permanent electrical connection between an integrated circuit device lead element...
A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact...
US-7,094,046 Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of...
US-7,093,704 Printed circuit board support
A printed circuit board conveying system is provided comprising a printed circuit board conveyor and a printed circuit board support. The printed circuit board...
US-7,093,622 Apparatus for deforming resilient contact structures on semiconductor components
A method for testing and burning-in semiconductor components such as semiconductor dice on a semiconductor wafer, is provided. The method includes the step of...
US-7,093,559 Method for PECVD deposition of selected material films
A process for PECVD of selected material films on a substrate comprising the steps of placing a substrate in a PECVD chamber and maintaining the chamber under...
US-7,093,358 Method for fabricating an interposer
An interposer including a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, with an interposer substrate. The...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.