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Container capacitor structure and method of formation thereof
Disclosed is a container capacitor structure and method of constructing it. An etch mask and etch are used to expose portions of an exterior surface of...
Methods for securing semiconductor devices using elongated fasteners
Semiconductor device assemblies include elements such as electronic components and substrates secured together by a fastener that includes an elongated portion...
Confined resistance variable memory cell structures and methods
Confined resistance variable memory cell structures and methods are described herein. One or more methods of forming a confined resistance variable memory cell...
Methods of patterning positive photoresist
A method of patterning positive photoresist includes providing positive photoresist over a substrate. An area of the positive photoresist is exposed to a...
Method and apparatus for surface tension control in advanced
A method and apparatus are used for cleaning and drying a semiconductor wafer. Within a sealable chamber, a wafer having photoresist features thereon is spun...
Alternating self-assembling morphologies of diblock copolymers controlled
by variations in surfaces
Methods for fabricating sublithographic, nanoscale microstructures arrays including openings and linear microchannels utilizing self-assembling block...
Extensions of self-assembled structures to increased dimensions via a
"bootstrap" self-templating method
Methods for fabricating sublithographic, nanoscale arrays of openings and linear microchannels utilizing self-assembling block copolymers, and films and devices...
Sub-10 nm line features via rapid graphoepitaxial self-assembly of
Methods for fabricating sublithographic, nanoscale microchannels utilizing an aqueous emulsion of an amphiphilic agent and a water-soluble, hydrogel-forming...
Platforms, apparatuses, systems and methods for processing and analyzing
Devices and methods for manufacturing displays, solar panels and other devices using larger size workpieces are provided. The workpiece is rolled into a...
Methods of data handling
Methods of data handling include receiving data having a previously-generated error correction code and generating one or more error correction codes for the...
JTAG controlled self-repair after packaging
An integrated circuit containing memory includes IEEE 1149.1 (JTAG) controlled self-repair system that permits permanent repair of the memory after the...
Method, apparatus, and system for erasing memory
Methods, apparatus, and systems may operate to perform a pre-programming operation on a plurality of multiple level memory cells of a memory device. An example...
Memory device with a decreasing dynamic pass voltage for reducing
The present disclosure includes methods, devices, modules, and systems for operating memory cells. One method embodiment includes applying sensing voltages to...
Memory devices, memory device constructions, constructions, memory device
forming methods, current conducting...
Some embodiments include memory devices having a wordline, a bitline, a memory element selectively configurable in one of three or more different resistive...
Methods, apparatuses and systems using windowing to accelerate automatic
Methods, apparatuses and systems are disclosed for accelerating the operation of the automatic functions of an imager, e.g. a camera system. The automatic...
Semiconductor constructions and methods of forming layers
The invention includes methods of forming layers conformally over undulating surface topographies associated with semiconductor substrates. The undulating...
System with semiconductor components having encapsulated through wire
A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first...
Isolation trench structure
Among structures, methods, devices, and systems for isolation trenches, a semiconductor device is provided that includes a substrate and an isolation trench...
High-performance diode device structure and materials used for the same
A diode and memory device including the diode, where the diode includes a conductive portion and another portion formed of a first material that has...
Ultra thin TCS (SiCl.sub.4) cell nitride for DRAM capacitor with DCS
(SiH.sub.2Cl.sub.2) interface seeding layer
A method for forming silicon nitride films on semiconductor devices is provided. In one embodiment of the method, a silicon-comprising substrate is first...
Low dose super deep source/drain implant
A semiconductor device for reducing junction capacitance by an additional low dose super deep source/drain implant and a method for its fabrication are...
Semiconductor constructions and transistors, and methods of forming
semiconductor constructions and transistors
The invention includes a transistor device having a semiconductor substrate with an upper surface. A pair of source/drain regions are formed within the...
Polymer-based ferroelectric memory
Apparatus and systems may comprise electrode structures that include two or more dissimilar and abutting metal layers on a surface, some of the electrode...
JFET devices with increased barrier height and methods of making same
Devices and methods for providing JFET transistors with improved operating characteristics are provided. Specifically, one or more embodiments of the present...
Methods of reducing defect formation on silicon dioxide formed by atomic
layer deposition (ALD) processes
Methods for reducing and inhibiting defect formation on silicon dioxide formed by atomic layer deposition (ALD) are disclosed. Defect reduction is accomplished...
Selective etching of oxides to metal nitrides and metal oxides
A method is provided for selectively etching native oxides or other contaminants to metal nitrides and metal oxides during manufacture of a semiconductor...
Cobalt-doped indium-tin oxide films and methods
Methods of forming cobalt-doped indium-tin oxide structures are shown. Properties of structures include transparency, conductivity, and ferromagnetism....
DRAM with nanofin transistors
One aspect of the present subject matter relates to a memory. A memory embodiment includes a nanofin transistor having a first source/drain region, a second...
Methods of forming memory cells
Some embodiments include methods of utilizing polysilazane in forming non-volatile memory cells. The memory cells may be multi-level cells (MLCs). The...
Recessed channel negative differential resistance-based memory cell
Disclosed herein is an improved recessed thyristor-based memory cell. The disclosed cell comprises in one embodiment a conductive plug recessed into the bulk of...
Method and apparatus providing refractive index structure for a device
capturing or displaying images
A transient index stack having an intermediate transient index layer, for use in an imaging device or a display device, that reduces reflection between layers...
Error detection for multi-bit memory
Systems, methods, and devices are disclosed, including a device that includes a plurality of data locations, a quantizing circuit coupled to the plurality of...
Memory apparatus and method using erasure error correction to reduce power
An error correction circuit coupled to a plurality of memory cells in a memory device includes an error correcting code ("ECC") generator and an ECC controller....
Memory device program window adjustment
In one or more embodiments, a memory device is disclosed as having an adjustable programming window having a plurality of programmable levels. The programming...
Serial parallel interface for data word architecture
Subject matter disclosed herein relates to techniques involving transitioning serial data into a serial parallel interface.
Method of erasing memory cell
An embodiment of a method of erasing a target memory cell includes grounding a selected word line commonly coupled to portions of a row of memory cells...
Memory device distributed controller system
A memory device distributed controller circuit distributes memory control functions amongst a plurality of memory controllers. A master controller receives an...
Memory cell operation
Embodiments of the present disclosure provide methods, devices, modules, and systems for programming memory cells. One method includes determining a quantity of...
Non-volatile memory cell read failure reduction
The present disclosure includes various method, device, and system embodiments for reducing non-volatile memory cell read failures. One such method embodiment...
Multilevel phase change memory operation
Methods, devices, and systems associated with multilevel phase change memory cells are described herein. One or more embodiments of the present disclosure...
Imager method and apparatus employing photonic crystals
An image sensor and a method of forming an image sensor. The image sensor includes an array of pixel cells at a surface of a substrate. Each pixel cell has a...
Method, apparatus and system providing an image sensor having pixels with
multiple exposures, diodes and gain...
A method, apparatus and system are described providing a high dynamic range pixel. Operating conditions, including integration time and sensitivity of different...
Systems and methods to selectively connect antennas to receive and
backscatter radio frequency signals
Systems and methods to selectively attach and control antennas via diodes and current sources. In one embodiment, a system includes: an RFID reader having a...
Method and apparatus for output data synchronization with system clock
A circuit, delay-locked loop, memory device, system and method of synchronizing a clock are described. A circuit generally includes a delay line configured to...
Electronic device package
Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of...
Surround gate access transistors with grown ultra-thin bodies
A vertical transistor having an annular transistor body surrounding a vertical pillar, which can be made from oxide. The transistor body can be grown by a solid...
Interposer substrates and semiconductor device assemblies and electronic
systems including such interposer...
Chip-scale packages and assemblies thereof are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least...
Tantalum aluminum oxynitride high-K dielectric
Electronic apparatus and methods of forming the electronic apparatus may include a tantalum aluminum oxynitride film for use in a variety of electronic systems...
Buried decoupling capacitors, devices and systems including same, and
methods of fabrication
A buried decoupling capacitor apparatus and method are provided. According to various embodiments, a buried decoupling capacitor apparatus includes a...
Methods of forming memory cells on pillars and memories with memory cells
Methods of fabricating memory are disclosed. For example, a method includes fabricating rows of memory cells on pillars separated by isolation regions...