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Patent # Description
US-9,990,144 Stacked memory devices, systems, and methods
Memory requests for information from a processor are received in an interface device, and the interface device is coupled to a stack including two or more...
US-9,989,616 Memory arrays
Some embodiments include memory arrays. The memory arrays can have global bitlines extending along a first horizontal direction, vertical local bitlines...
US-9,985,651 Read threshold calibration for LDPC
Apparatuses and methods for soft read threshold location calibration are provided. One example method can include selecting read threshold sets (RTSs), and...
US-9,985,183 Solid state lighting devices with accessible electrodes and methods of manufacturing
Various embodiments of light emitting dies and solid state lighting ("SSL") devices with light emitting dies, assemblies, and methods of manufacturing are...
US-9,985,181 Epitaxial formation support structures and associated methods
Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are...
US-9,985,076 Diode/superionic conductor/polymer memory structure
A conjugated polymer layer with a built-in diode is formed by providing a first metal-chalcogenide layer over a bottom electrode. Subsequently, a second...
US-9,985,049 Arrays of elevationally-extending strings of memory cells and methods of forming memory arrays
An array of elevationally-extending strings of memory cells comprises a vertical stack of alternating insulative levels and wordline levels. The wordline levels...
US-9,985,040 Integrated circuitry and 3D memory
Integrated circuitry has an array circuitry region having a repeating array of electronic components. An adjacent circuitry region is immediately laterally...
US-9,985,000 Stacked semiconductor die assemblies with die support members and associated systems and methods
Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die...
US-9,984,977 Semiconductor constructions
Some embodiments include a construction having conductive structures spaced from one another by intervening regions. Insulative structures are within the...
US-9,984,756 Fast programming memory device
In an embodiment of a memory device including a matrix of memory cells wherein the memory cells are arranged in a plurality of memory cells strings each one...
US-9,979,915 Pixel array with shared pixels in a single column and associated devices, systems, and methods
Pixel array with shared pixels in a single column and associated devices, systems, and methods are disclosed herein. In one embodiment, a pixel array includes a...
US-9,977,902 Enabling a secure boot from non-volatile memory
A system may include a host that may include a processor coupled to a non-volatile memory over a secure communication protocol. As a result, prior to release...
US-9,977,603 Memory devices for detecting known initial states and related methods and electronic systems
A memory device includes a memory array having non-volatile memory cells, and a memory controller configured to detect a known state to enter based, at least in...
US-9,975,206 Composition of solid-containing paste
Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the...
US-9,974,965 Relay module for implant
An implementation provides a system that includes: a control module including a first antenna, the control module configured to generate a first radio frequency...
US-9,973,719 Antiblooming imaging apparatus, systems, and methods
Apparatus, systems, and methods are described to assist in reducing dark current in an active pixel sensor. In various embodiments, a potential barrier...
US-9,973,181 Synchronized semiconductor device with phase adjustment circuit
According to one embodiment, a synchronous semiconductor device is disclosed According to this embodiment, the synchronous semiconductor device includes a pulse...
US-9,972,862 Secondary battery
Provided is a secondary battery in which a single-layer secondary cell has an all-solid-state secondary cell structure with a storage layer sandwiched between a...
US-9,972,770 Methods of forming memory cells, arrays of magnetic memory cells, and semiconductor devices
Magnetic memory cells, methods of fabrication, semiconductor device structures, and memory systems are disclosed. A magnetic cell core includes at least one...
US-9,972,628 Conductive structures, wordlines and transistors
Some embodiments include a conductive structure which has a first conductive material having a work function of at least 4.5 eV, and a second conductive...
US-9,972,532 Interconnect structures for integrated circuits and their formation
An embodiment of an interconnect structure for an integrated circuit may include a first conductor coupled to circuitry, a second conductor, a dielectric...
US-9,972,391 Apparatus, systems, and methods to operate a memory
Various embodiments, disclosed herein, include apparatus and methods to read a logic level in a selected memory cell in a selected string of a memory by sensing...
US-9,972,367 Shifting data in sensing circuitry
The present disclosure includes apparatuses and methods related to shifting data. An example apparatus comprises sensing circuitry including a sense amplifier...
US-9,972,363 Apparatus for impedance adjustment and methods of their operation
Apparatus include a data bus and a signal driver circuit having pluralities of first and second termination devices connected in parallel between a voltage node...
US-9,971,541 Apparatuses and methods for data movement
The present disclosure includes apparatuses and methods for data movement. An example apparatus includes a memory device that includes a plurality of subarrays...
US-9,971,536 Controller to manage NAND memories
Various embodiments disclose a controller to manage memory devices. In an exemplary method, signals are exchanged with a host processor to allow the host...
US-9,966,451 Integrated structures
Some embodiments include an integrated structure having a vertical stack of alternating insulative levels and conductive levels. Recesses extend into the...
US-9,966,406 Semiconductor devices including back-side integrated circuitry
Semiconductor devices may include a semiconductor substrate comprising at least one of transistors and capacitors may be located at an active surface of the...
US-9,966,347 Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
The present technology is directed to manufacturing semiconductor dies with under-bump metal (UBM) structures for die-to-die and/or package-to-package...
US-9,966,127 Compensating for variations in selector threshold voltages
Methods, systems, and devices are described for operating a memory array. A first voltage may be applied to a memory cell to activate a selection component of...
US-9,966,116 Apparatuses and methods for storing a data value in a sensing circuitry element
The present disclosure includes apparatuses and methods related to storing a data value in a sensing circuitry element. An example method comprises sensing a...
US-9,960,346 Magnetic tunnel junctions
A magnetic tunnel junction has a conductive first magnetic electrode comprising magnetic recording material. A conductive second magnetic electrode is spaced...
US-9,960,258 Methods of forming transistor gates
Some embodiments include methods of forming charge storage transistor gates and standard FET gates in Which common processing is utilized for fabrication of at...
US-9,960,150 Semiconductor device assembly with through-mold cooling channel formed in encapsulant
Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one...
US-9,960,148 Methods for transferring heat from stacked microfeature devices
Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly...
US-9,960,114 Structure of integrated circuitry and a method of forming a conductive via
A method of forming a conductive via comprises forming a structure comprising an elevationally-extending-conductive via and a conductive line electrically...
US-9,960,094 Packaged semiconductor components having substantially rigid support members and methods of packaging...
Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member...
US-9,959,931 Programming a memory device in response to its program history
A method includes determining, internal to a memory device, a number of program pulses required to program a sample of memory cells of the memory device during...
US-9,959,929 Memory device and method having on-board processing logic for facilitating interface with multiple processors,...
A memory device includes an on-board processing system that facilitates the ability of the memory device to interface with a plurality of processors operating...
US-9,959,923 Apparatuses and methods to reverse data stored in memory
Apparatuses and methods are provided for reversing data stored in memory. An example apparatus comprises an array of memory cells, a first plurality of sensing...
US-9,959,921 Apparatuses and methods for refresh control
Apparatuses and methods of for refresh control of a semiconductor device are described. An example apparatus includes a command control circuit that provides a...
US-9,959,913 Apparatuses and methods for performing logical operations using sensing circuitry
The present disclosure includes apparatuses and methods related to performing logical operations using sensing circuitry. An example apparatus comprises an...
US-9,959,732 Method and system for fall detection
The present disclosure provides a method and a system for fall detection. Measurement signals are received from a plurality of sensors to monitor user...
US-9,959,474 Bus translator
Disclosed are methods and devices, among which is a device including a bus translator. In some embodiments, the device also includes a core module and a core...
US-9,959,220 Memory tile access and selection patterns
In one embodiment, an apparatus, such as a memory device, is disclosed. The apparatus includes multiple memory tiles and selection circuitry. Each memory tile...
US-9,958,887 Device having internal voltage generating circuit
A device includes an amplifying circuit having first and second input terminals and an output terminal, a ground terminal, a variable resistance circuit, and a...
US-9,958,624 Apparatus providing simplified alignment of optical fiber in photonic integrated circuits
A structure for optically aligning an optical fiber to a protonic device and method of fabrication of same. The structure optically aligns an optical fiber to...
US-9,954,517 Apparatuses and methods for duty cycle adjustment
Apparatuses, duty cycle adjustment circuits, adjustment circuits, and methods for duty cycle adjustment are disclosed herein. An example duty cycle adjustment...
US-9,954,437 Charge pump
One charge pump includes at least one delay element, a number of inverters, and a flip flop coupled in series, with an output of one inverter coupled in a...
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