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Tungsten-doped indium oxide structures and methods
Methods of forming transparent conducting oxides and devices formed by these methods are shown. Monolayers that contain tungsten and monolayers that contain...
Semiconductor material manufacture
Electronic apparatus, systems, and methods include a semiconductor layer bonded to a bulk region of a wafer or a substrate, in which the semiconductor layer can...
Methods of forming electrically insulative materials, methods of forming
low k dielectric regions, and methods...
Some embodiments include methods of forming low k dielectric regions between electrically conductive lines. A construction may be formed to have a plurality of...
Devices with nanocrystals and methods of formation
An aspect relates to a method of growing nanoscale structures on a semiconductor substrate. According to various embodiments, nucleation sites are created on a...
Methods, devices, and systems integrating Fin-JFETs and Fin-MOSFETs are provided. One method embodiment includes forming at least on Fin-MOSFET on a substrate...
Method and apparatus for directing molding compound flow and resulting
semiconductor device packages
Flow diverting structures for preferentially impeding, redirecting or both impeding and redirecting the flow of flowable encapsulant material, such as molding...
Optic wafer with reliefs, wafer assembly including same and methods of
dicing wafer assembly
An optic wafer for assembly with an imager wafer, the optic wafer comprising a plurality of reliefs in a surface thereof coincident with street locations...
Poly etch without separate oxide decap
The use of an ammonium hydroxide spike to a hot tetra methyl ammonium hydroxide (TMAH) solution to form an insitu poly oxide decapping step in a polysilicon...
Apparatus for removing material from microfeature workpieces
Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a...
Electronic apparatus, systems, and methods of operating and constructing the electronic apparatus and/or systems include an embedded processor disposed in a...
Systems, methods and devices for limiting current consumption upon
Embodiments are described including those for controlling peak current consumption of a multi-chip memory package during power-up. In one embodiment, each...
Memory register encoding systems and methods
Apparatus, systems, and methods are disclosed that operate to encode register bits to generate encoded bits such that, for pairs of addresses, an encoded bit to...
Techniques for simultaneously driving a plurality of source lines
Techniques for simultaneously driving a plurality of source lines are disclosed. In one particular exemplary embodiment, the techniques may be realized as an...
Method for memory cell erasure with a programming monitor of reference
Embodiments of the present disclosure provide methods, devices, modules, and systems for operating memory cells. One method includes: performing an erase...
Programming method to reduce word line to word line breakdown for NAND
A NAND architecture non-volatile memory device and programming process programs the various cells of strings of non-volatile memory cells by the application of...
Selective threshold voltage verification and compaction
Non-volatile memory devices for providing selective compaction verification and/or selective compaction to facilitate a tightening of the distribution of...
Word line voltage boost system and method for non-volatile memory devices
and memory devices and...
The voltage of a selected word line is increased beyond the voltage to which a respective string driver transistor is capable of driving the word line by...
Resistance variable memory with temperature tolerant materials
A PCRAM memory device having a chalcogenide glass layer, preferably comprising antimony selenide having a stoichiometric formula of about Sb.sub.2Se.sub.3, and...
Dual panel pixel readout in an imager
An imager having two panels of pixels (i.e., the imager's rows of pixels are split into two panels) that are controllable by separate row decoders. The dual...
Probe and electrical connecting apparatus using it
A probe having an alignment mark that is hardly influenced by scraps of an electrode scraped by a probe tip is provided. A probe according to the present...
Electric connecting apparatus
In an electrical connecting apparatus, a thermal deformation restriction member, a reinforcing plate, and an auxiliary member are made of materials having...
Microelectronic component assemblies and microelectronic component lead
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead...
Methods of forming electronic devices containing Zr-Sn-Ti-O films
A dielectric film containing Zr--Sn--Ti--O and methods of fabricating such a dielectric film produce a reliable dielectric layer having an equivalent oxide...
Pitch multiplication using self-assembling materials
Self-assembling materials, such as block copolymers, are used as mandrels for pitch multiplication. The copolymers are deposited over a substrate and directed...
Tunnel dielectric comprising nitrogen for use with a semiconductor device
and a process for forming the device
A method used during semiconductor device fabrication comprises forming at least two types of transistors. A first transistor type may comprise a CMOS...
Method of forming a capacitor
A method of forming a capacitor includes forming a first capacitor electrode over a substrate. A substantially crystalline capacitor dielectric layer is formed...
Methods of forming conductive contacts to source/drain regions and methods
of forming local interconnects
The invention comprises methods of forming a conductive contact to a source/drain region of a field effect transistor, and methods of forming local...
Imager die package and methods of packaging an imager die on a temporary
Methods for fabricating an imager die package and resulting die packages are disclosed. An imager die packaging process may include dicing through a fabrication...
Multi-focus method of enhanced three-dimensional exposure of resist
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a...
Methods of forming photomasks
Some embodiments include methods of forming photomasks. A stack of at least three different materials is formed over a base. Regions of the stack are removed to...
Atomic layer deposition method of forming conductive metal
This invention includes atomic layer deposition methods of forming conductive metal nitride comprising layers. In one implementation, an atomic layer deposition...
Method and system for binding halide-based contaminants
A method and apparatus are presented for reducing halide-based contamination within deposited titanium-based thin films. Halide adsorbing materials are utilized...
Systems and methods for reducing electrostatic charge of semiconductor
A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier...
The present disclosure includes methods, and circuits, for operating a memory device. One method embodiment for operating a memory device includes controlling...
Methods and apparatuses relating to automatic cell threshold voltage
Methods and apparatuses for automatically measuring memory cell threshold voltages are disclosed. Measurement circuitry includes an internal reference current...
Dynamic soft program trims
Systems and methods are disclosed for modifying soft-programming trims of a non-volatile memory device, such as a flash memory device. The soft-programming...
Shielding black reference pixels in image sensors
An image sensor having an array of pixel cells, each including a photo-conversion device. The array has first, second, and third groups of pixel cells. The...
Band-gap reference voltage detection circuit
Methods, devices, modules, and systems for a band-gap reference voltage detection circuit are provided. One embodiment for a band-gap reference voltage...
Some embodiments include methods of forming semiconductor constructions. Oxide is formed over a substrate, and first material is formed over the oxide. Second...
Stacked semiconductor component having through wire interconnect
A stacked semiconductor component includes a plurality of semiconductor substrates in a stacked array and a continuous wire extending through aligned vias on...
Liner for shallow trench isolation
A method of depositing dielectric material into sub-micron spaces and resultant structures is provided. After a trench is etched in the surface of a wafer, a...
Capacitor-less memory cells and cell arrays
A capacitor-less memory cell, memory device, system and process of forming the capacitor-less memory cell includes forming the memory cell in an active area of...
Methods of forming pluralities of capacitors
The invention includes methods of forming pluralities of capacitors. In one implementation, a method of forming a plurality of capacitors includes providing a...
Method for a multiple exposure beams lithography tool
An aspect of the present invention includes a method for patterning a workpiece covered at least partly with a layer sensitive to electromagnetic radiation by...
Methods for placing substrates in contact with molten solder
Methods and devices for placing a semiconductor wafer or other substrate in contact with solder are described. A wave soldering apparatus includes a solder...
BIOS lock encode/decode driver
Systems and methods for preventing the unauthorized access to data stored on removable media, such as software, include storing a predetermined signature in the...
Method for reading a multilevel cell in a non-volatile memory device
A non-volatile memory device has a memory array comprising a plurality of memory cells. The array can operate in either a multilevel cell or single level cell...
Disclosed are methods and devices, among which is a device including a bus translator. In some embodiments, the device also includes a core module and a core bus...
Non-volatile memory devices, systems including same and associated methods
A memory device, system and method of editing a file in a non-volatile memory device is described. The memory device includes a controller and a memory array...
A NAND interface having a reduced pin count configuration, in which all command and address functions and operations of the NAND are provided serially on a...