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Patent # Description
US-7,838,920 Trench memory structures and operation
Memory cells utilizing dielectric charge carrier trapping sites formed in trenches provide for non-volatile storage of data. The memory cells of the various...
US-7,838,381 Stud capacitor device and fabrication method
The present teachings relate to a method of forming a container capacitor structure on a substrate. In one embodiment, the method comprises etching a recess in...
US-7,838,362 Method of making an embedded trap direct tunnel non-volatile memory
The cell comprises a substrate having a drain region and a source region. An oxynitride layer is formed over the substrate. An embedded trap layer is formed over...
US-7,838,360 Memory array with surrounding gate access transistors and capacitors with global and staggered local bit lines
A memory array with staggered local data/bit lines extending generally in a first direction formed in an upper surface of a substrate and memory cell access...
US-7,838,183 Multi-layer, attenuated phase-shifting mask
The present invention provides an attenuated phase shift mask ("APSM") that, in each embodiment, includes completely transmissive regions sized and shaped to...
US-7,838,178 Masks for microlithography and methods of making and using such masks
Masks for microlithography apparatus, methods for making such masks, and methods for exposing photosensitive materials to form arrays of microfeatures on...
US-7,838,084 Atomic layer deposition method of depositing an oxide on a substrate
The invention includes atomic layer deposition methods of depositing an oxide on a substrate. In one implementation, a substrate is positioned within a...
US-7,837,889 Methods of etching nanodots, methods of removing nanodots from substrates, methods of fabricating integrated...
Embodiments of the invention include methods of etching nanodots, to methods of removing nanodots from substrates, and to methods of fabricating integrated...
US-7,837,805 Methods for treating surfaces
Some embodiments include methods of treating surfaces with aerosol particles. The aerosol particles may be formed as liquid particles, and then passed through a...
US-7,837,797 Systems and methods for forming niobium and/or vanadium containing layers using atomic layer deposition
A method of forming (and an apparatus for forming) a metal containing layer on a substrate, particularly a semiconductor substrate or substrate assembly for use...
US-7,836,374 Memory controller method and system compensating for memory cell data losses
A computer system includes a memory controller coupled to a memory module containing several DRAMs. The memory module also includes a non-volatile memory storing...
US-7,836,363 DVI link with circuit and method for test
A method of transmitting data through a link comprises encoding digital data into encoded digital data in a transition minimized differential signaling encoder,...
US-7,836,362 Circuits and methods for repairing defects in memory devices
Some embodiments of the invention include a memory device has a number of memory segments connected to a supply source through a supply control circuit. The...
US-7,836,252 System and method for optimizing interconnections of memory devices in a multichip module
An apparatus and method couples memory devices in a memory module to a memory hub on the module such that signals traveling from the hub to the devices have the...
US-7,835,533 Method for manufacturing condenser microphone
A circuit board forming member, a case forming member, a spacer forming member, a diaphragm sheet and a diaphragm plate forming member are laminated to form a...
US-7,835,532 Microphone array
By integrating plural condenser microphone constituting bodies in an array state, a condenser microphone array is obtained.The condenser microphone array is...
US-7,835,207 Stacked device remapping and repair
Various embodiments include apparatus, systems, and methods having multiple dice arranged in a stack in which a defective cell may be replaced by a spare cell on...
US-7,835,205 Delay stage-interweaved analog DLL/PLL
A methodology is disclosed that enables the delay stages of an analog delay locked loop (DLL) or phase locked loop (PLL) to be programmed according to the...
US-7,835,194 Erase operation in a flash memory device
A method for erasing a non-volatile memory device performs a block erase operation. The cells are then soft programmed and erase verified to determine if the...
US-7,835,190 Methods of erase verification for a flash memory device
Methods and apparatus are disclosed, such as those involving a flash memory device that includes a memory block. The memory block includes a plurality of data...
US-7,835,173 Resistive memory
The present disclosure includes resistive memory devices and systems having resistive memory cells, as well as methods for operating the resistive memory cells....
US-7,835,158 Connection verification technique
Embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a...
US-7,834,342 Phase change material and methods of forming the phase change material
A phase change material including a high adhesion phase change material formed on a dielectric material and a low adhesion phase change material formed on the...
US-7,833,914 Capacitors and methods with praseodymium oxide insulators
Methods of forming and the resulting capacitors formed by these methods are shown. Monolayers that contain praseodymium are deposited onto a substrate and...
US-7,833,894 Devices and systems having at least one dam structure
A method for forming through-wafer interconnects (TWI) in a substrate. Blind holes are formed from a surface, sidewalls thereof are passivated and coated with a...
US-7,833,892 Method of forming a field effect transistor
The invention includes methods of forming integrated circuitry, methods of forming memory circuitry, and methods of forming field effect transistors. In one...
US-7,833,881 Methods for fabricating semiconductor components and packaged semiconductor components
Packaged semiconductor components and methods for manufacturing packaged semiconductor components. In one embodiment a semiconductor component comprises a die...
US-7,833,860 Recessed gate dielectric antifuse
A recessed dielectric antifuse device includes a substrate and laterally spaced source and drain regions formed in the substrate. A recess is formed between the...
US-7,833,832 Method of fabricating semiconductor components with through interconnects
A method for fabricating a semiconductor component with through interconnects can include the steps of providing a semiconductor substrate with substrate...
US-7,833,601 Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed...
Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods are disclosed herein. A method...
US-7,833,456 Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece are disclosed. A method in accordance with one aspect includes placing a...
US-7,833,427 Electron beam etching device and method
Methods and devices for selective etching in a semiconductor process are shown. Chemical species generated in a reaction chamber provide both a selective etching...
US-7,833,036 Electrical connecting apparatus
An electrically connecting apparatus comprises a base member provided with slots penetrating in the plate thickness direction, contacts disposed within the slots...
US-7,831,870 JTAG controlled self-repair after packaging
An integrated circuit containing memory includes IEEE 1149.1 (JTAG) controlled self-repair system that permits permanent repair of the memory after the...
US-7,831,765 Distributed programmable priority encoder capable of finding the longest match in a single operation
A distributed, hierarchically-structured, programmable priority encoder for a content addressable memory (CAM) device including at least one section, the section...
US-7,830,733 Devices, systems, and methods for independent output drive strengths
Methods, apparatuses and systems are disclosed for independently configurable data and strobe drivers within a memory device. A memory device may include at...
US-7,830,729 Digital filters with memory
A memory device that, in certain embodiments, includes a memory element coupled to a bit-line and a quantizing circuit coupled to the memory element via the...
US-7,830,718 Mitigation of data corruption from back pattern and program disturb in a non-volatile memory device
In one of the disclosed embodiments, a write algorithm is used to remove errors due to back pattern effects, cell-to-cell capacitive coupling, and program...
US-7,830,426 Method and apparatus providing color interpolation in color filter arrays using edge detection and correction terms
A method and apparatus for color plane interpolation are provided which interpolates the color values of pixels differently depending on an edge direction and...
US-7,830,221 Coupling cancellation scheme
Methods and apparatus are disclosed, such as those involving an interconnection layout for an integrated circuit (IC). One such layout includes a plurality of...
US-7,830,018 Partitioned through-layer via and associated systems and methods
Partitioned vias, interconnects, and substrates that include such vias and interconnects are disclosed herein. In one embodiment, a substrate has a ...
US-7,829,991 Stackable ceramic FBGA for high thermal applications
An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor...
US-7,829,979 High permeability layered films to reduce noise in high speed interconnects
An apparatus provides a memory having a transmission line circuit with an associated high permeability material. The high permeability material may include a...
US-7,829,976 Microelectronic devices and methods for forming interconnects in microelectronic devices
Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In...
US-7,829,938 High density NAND non-volatile memory device
Non-volatile memory devices and arrays are described that utilize dual gate (or back-side gate) non-volatile memory cells with band engineered gate-stacks that...
US-7,829,410 Methods of forming capacitors, and methods of forming DRAM arrays
Some embodiments include methods of forming capacitors. A first section of a capacitor may be formed to include a first storage node, a first dielectric...
US-7,829,399 Capacitorless DRAM on bulk silicon
A method of forming capacitorless DRAM over localized silicon-on-insulator comprises the following steps: A silicon substrate is provided, and an array of...
US-7,829,385 Taped semiconductor device and method of manufacture
Printed tape is used to form a leads on chip (LOC) ball grid array (BGA) semiconductor device. Leads for a plurality of devices may be applied simultaneously....
US-7,829,262 Method of forming pitch multipled contacts
Methods of forming electrically conductive and/or semiconductive features for use in integrated circuits are disclosed. Various pattern transfer and etching...
US-7,829,190 Electrical interconnect using locally conductive adhesive
An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one...
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