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| Patent # | Description |
|---|---|
| US-7,760,582 |
Apparatus for memory device wordline A method and apparatus for improving the speed of a wordline in a memory device. A wordline structure includes a main wordline for selectively distributing a... |
| US-7,760,533 |
Systems, methods and devices for arbitrating die stack position in a
multi-bit stack device Embodiments are described for arbitrating stacked dies in multi-die semiconductor packages. In one embodiment, die identification data for at least two stacked... |
| US-7,760,532 |
Multi-bank memory A multi-bank memory device includes rows and columns of memory cores. Each row includes memory cores from one bank interleaved with memory cores from another... |
| US-7,760,329 |
Optimized optical lithography illumination source for use during the
manufacture of a semiconductor device A method and structure for optimizing an optical lithography illumination source may include a shaped diffractive optical element (DOE) interposed between the... |
| US-7,760,019 |
Adaptive operational transconductance amplifier load compensation A buffer varies the size of its output stage in response to a varying capacitive load. The capacitive load may vary in a predictable or a random manner. The... |
| US-7,759,800 |
Microelectronics devices, having vias, and packaged microelectronic
devices having vias Microelectronic devices, methods for packaging microelectronic devices, and methods for forming vias and conductive interconnects in microfeature workpieces and... |
| US-7,759,785 |
Apparatus for packaging semiconductor devices, packaged semiconductor
components, methods of manufacturing... Packaged semiconductor components, apparatus for packaging semiconductor devices, methods of packaging semiconductor devices, and methods of manufacturing... |
| US-7,759,747 |
Tantalum aluminum oxynitride high-.kappa. dielectric Electronic apparatus and methods of forming the electronic apparatus may include a tantalum aluminum oxynitride film for use in a variety of electronic systems... |
| US-7,759,724 |
Memory cells having gate structure with multiple gates and multiple
materials between the gates Structures and methods are provided for SRAM cells having a novel, non-volatile floating gate transistor, e.g. a non-volatile memory component, within the cell... |
| US-7,759,717 |
Capacitors comprising dielectric regions having first and second oxide
material portions of the same chemical... A capacitor includes a first capacitor electrode which includes conductive metal. A second capacitor electrode is spaced from the first capacitor electrode. A... |
| US-7,759,715 |
Memory cell comprising dynamic random access memory (DRAM) nanoparticles
and nonvolatile memory (NVM) nanoparticle Some embodiments include memory cells that contain a dynamic random access memory (DRAM) element and a nonvolatile memory (NVM) element. The DRAM element... |
| US-7,759,665 |
PCRAM device with switching glass layer A memory device, such as a PCRAM, including a chalcogenide glass backbone material with germanium telluride glass and methods of forming such a memory device. |
| US-7,759,660 |
Electron beam lithography system Methods to reduce the write time for forming mask patterns having angled and non-angled features using electron beam lithography are disclosed. In one exemplary... |
| US-7,759,620 |
Fourier plane analysis and refinement of SLM calibration The present disclosure relates to phase-sensitive calibration of an SLM system. In particular, it relates to selecting among local calibrations when there is... |
| US-7,759,240 |
Use of palladium in IC manufacturing with conductive polymer bump An apparatus and a method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible... |
| US-7,759,237 |
Method of forming lutetium and lanthanum dielectric structures Methods of forming dielectric structures are shown. Methods of forming dielectric structures are shown that include lutetium oxide and lanthanum aluminum oxide... |
| US-7,759,233 |
Methods for stressing semiconductor material structures to improve
electron and/or hole mobility of transistor... Semiconductor material strips are secured to substrates in such a way as to stress the semiconductor material. The strips of semiconductor material may be... |
| US-7,759,221 |
Methods for packaging microelectronic devices and microelectronic devices
formed using such methods Methods for packaging microelectronic devices and microelectronic devices formed using such methods are disclosed herein. One aspect of the invention is directed... |
| US-7,759,197 |
Method of forming isolated features using pitch multiplication Crisscrossing spacers formed by pitch multiplication are used as a mask to form isolated features, such as contacts vias. A first plurality of mandrels are... |
| US-7,759,193 |
Methods of forming a plurality of capacitors A method of forming a plurality of capacitors includes forming a plurality of individual capacitor electrodes using two masking steps. An earlier of the two... |
| US-7,759,187 |
Metal plating using seed film A seed film and methods incorporating the seed film in semiconductor applications is provided. The seed film includes one or more noble metal layers, where each... |
| US-7,759,183 |
Dual work function metal gates and methods of forming Complementary transistors and methods of forming the complementary transistors on a semiconductor assembly are described. The transistors can be formed from a... |
| US-7,759,154 |
Ultrashallow photodiode using indium The invention provides an imager having a p-n-p photodiode with an ultrashallow junction depth. A p+ junction layer of the photodiode is doped with indium to... |
| US-7,759,053 |
Methods of fabricating integrated circuitry The invention includes methods of fabricating integrated circuitry and semiconductor processing polymer residue removing solutions. In one implementation, a... |
| US-7,757,385 |
System for fabricating semiconductor components with through wire
interconnects A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back... |
| US-7,757,061 |
System and method for decoding commands based on command signals and
operating state A system and method for decoding command signals that includes a command decoder configured to generate internal control signals to perform an operation based on... |
| US-7,755,940 |
Method, apparatus, and system for erasing memory Methods, apparatus, and systems may operate such as to perform a pre-programming operation on a plurality of multiple level memory cells of a memory device. One... |
| US-7,755,939 |
System and devices including memory resistant to program disturb and
methods of using, making, and operating... Disclosed are methods, systems and devices, one such device being a memory device configured to concurrently assert a first pulse pattern through a plurality of... |
| US-7,755,684 |
Row driver circuitry for imaging devices and related method of operation Row drivers as a part of an image sensor device include circuitry for supplying a plurality of signals with an increased voltage and enhanced reliability to a... |
| US-7,755,657 |
Method for high precision printing of patterns The present invention includes a method to print patterns with improved edge acuity. The method for printing fine patterns comprises the actions of: providing an... |
| US-7,755,570 |
Microdisplay and interface on a single chip A microdisplay having interface circuitry on the same silicon backplane to allow it to receive digital images and video in a variety of formats and convert same... |
| US-7,755,404 |
Delay locked loop circuit and method Delay locked loop circuits and methods are disclosed. In the embodiments, a delay locked loop may include a phase detector to detect a phase difference between a... |
| US-7,755,385 |
Method for operating an electronic device with reduced pin capacitance A method of operating an electronic device having an output driver with on die termination legs ODT, and non-ODT legs, includes the step of selectively... |
| US-7,755,316 |
Moving member movement control apparatus, moving member movement control
method and machine tool movement... A movement control apparatus for a moving member, includes: a drive unit that moves a moving member by rapid traverse on a first axis and a second axis... |
| US-7,755,204 |
Stacked die module including multiple adhesives that cure at different
temperatures A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked... |
| US-7,755,183 |
Wiring board, method of manufacturing the same, and semiconductor device According to this invention, a wiring board includes a conductive pattern formed from leads each of which is formed on an organic layer and has a thickness t... |
| US-7,755,119 |
Method and apparatus for reducing imager floating diffusion leakage An imager having reduced floating diffusion leakage and a mechanism for improving the storing of collected charge is described. A polysilicon contact is provided... |
| US-7,754,618 |
Method of forming an apparatus having a dielectric containing cerium oxide
and aluminum oxide A dielectric layer including cerium oxide and aluminum oxide acting as a single dielectric layer, and a method of fabricating such a dielectric layer, produces a... |
| US-7,754,612 |
Methods and apparatuses for removing polysilicon from semiconductor
workpieces Methods and apparatuses for removing polysilicon material from a semiconductor workpiece are disclosed. A particular method includes contacting a polishing pad... |
| US-7,754,576 |
Method of forming inside rough and outside smooth HSG electrodes and
capacitor structure A container capacitor and method of forming the container capacitor are provided. The container capacitor comprises a lower electrode fabricated by forming a... |
| US-7,754,532 |
High density chip packages, methods of forming, and systems including same Methods and devices for multi-chip stacks are shown. A method is shown that assembles multiple chips into stacks by stacking wafers prior to dicing into... |
| US-7,754,531 |
Method for packaging microelectronic devices Methods for packaging microelectronic devices and microelectronic devices formed by such methods are disclosed herein. In one embodiment, a method includes... |
| US-7,754,522 |
Phase change memory structures and methods Methods, devices, and systems associated with phase change memory structures are described herein. One or more embodiments of the present disclosure can reduce... |
| US-7,754,399 |
Methods of forming reticles The invention includes reticle constructions and methods of forming reticle constructions. In a particular aspect, a method of forming a reticle includes... |
| US-7,754,395 |
Methods of forming and using reticles Some embodiments include methods of treating reticles to provide backside masking across regions of the reticle to compensate for problems occurring during... |
| US-7,753,693 |
Contacts and electrical connecting apparatus using the same An electrical connecting apparatus uses a plurality of contacts each of which includes: a principal portion having an outer face curved and directed to a... |
| US-RE41,441 |
Output buffer having inherently precise data masking A maskable data output buffer includes an output stage receiving data signals from a data coder. The signals output from the data coder are normally... |
| US-7,752,381 |
Version based non-volatile memory translation layer A non-volatile memory and erase block/data block/sector/cluster update and address translation scheme utilizing a version number is detailed that enhances data... |
| US-7,751,634 |
Compression system for integrated sensor devices An imaging system incorporating adaptive compression which includes determining linear predictive differential residuals from an imager array pixel row. The... |
| US-7,751,263 |
Data retention kill function Various data protection techniques are provided. In one embodiment, a method includes manufacturing a memory component of an electronic system. Manufacturing the... |
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