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Patent # | Description |
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US-7,999,328 |
Isolation trench having first and second trench areas of different widths A method of forming and resulting isolation region, which allows for densification of an oxide layer in the isolation region. One exemplary embodiment of the... |
US-7,998,860 |
Method for fabricating semiconductor components using maskless back side
alignment to conductive vias A method for fabricating semiconductor components includes the steps of: providing a semiconductor substrate having a circuit side, a back side and conductive... |
US-7,998,813 |
Methods of fabricating an access transistor having a
polysilicon-comprising plug on individual of opposing... Fabrication methods for gate transistors in integrated circuit devices enable the formation of recessed access device structures or FinFET structures having... |
US-7,998,809 |
Method for forming a floating gate using chemical mechanical planarization An improved process forming a floating gate region of a semiconductor memory device. The process includes using a ceria slurry for chemical mechanical... |
US-7,998,305 |
Electrical interconnect using locally conductive adhesive An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one... |
US-7,997,958 |
Apparatuses and methods for conditioning polishing pads used in polishing
micro-device workpieces Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for... |
US-7,997,954 |
Centerless grinding method To provide a centerless grinding method which facilitates a tooling change and enables automation. A blade 11 is disposed slidable along a first straight line... |
US-7,996,727 |
Error correction for memory Methods and devices operate to apply and provide differing levels of error correction within a multi-level, non-volatile memory. In an example, the differing... |
US-7,995,415 |
System and method for reducing power consumption during extended refresh
periods of dynamic random access... A dynamic random access memory ("DRAM") device is operable in either a normal refresh mode or a static refresh mode, such as a self-refresh mode. A cell plate... |
US-7,995,412 |
Analog-to-digital and digital-to-analog conversion window adjustment based
on reference cells in a memory device An analog-to-digital conversion window is defined by reference voltages stored in reference memory cells of a memory device. A first reference voltage is read... |
US-7,995,402 |
Method for erasing a semiconductor magnetic memory integrating a magnetic
tunneling junction above a... A semiconductor magnetic memory device has a magnetic tunneling junction formed over a memory cell. The memory cell has a control gate surrounded by a floating... |
US-7,995,400 |
Reducing effects of program disturb in a memory device The programming disturb effects in a semiconductor non-volatile memory device are reduced by biasing unselected word lines of a memory block with a negative... |
US-7,995,399 |
NAND memory device and programming methods A NAND Flash memory device reduces circuitry noise during program operations. The memory includes bit lines that are electrically coupled together to charge... |
US-7,995,395 |
Charge loss compensation during programming of a memory device A selected memory cell on a selected word line is programmed through a plurality of programming pulses that are incremented by a step voltage. After a... |
US-7,995,391 |
Multiple select gates with non-volatile memory cells Multiple select gates in association with non-volatile memory cells are described. Various embodiments include multiple select gate structure, process, and... |
US-7,995,365 |
Method and apparatuses for managing double data rate in non-volatile
memory Described herein are a method and apparatuses for providing DDR memory access. In one embodiment, an apparatus includes a data storage unit to store and... |
US-7,994,849 |
Devices, systems, and methods for generating a reference voltage Methods, devices, and systems are disclosed for a voltage reference generator. A voltage reference generator may comprise a bandgap voltage reference circuit... |
US-7,994,595 |
Strained semiconductor by full wafer bonding One aspect of this disclosure relates to a method for forming a wafer with a strained semiconductor. In various embodiments of the method, a predetermined... |
US-7,994,566 |
Stacked non-volatile memory with silicon carbide-based amorphous silicon
finFETs A stacked non-volatile memory device uses amorphous silicon based thin film transistors stacked vertically. Each layer of transistors or cells is formed from a... |
US-7,994,547 |
Semiconductor devices and assemblies including back side redistribution
layers in association with through... Low temperature processed back side redistribution lines (RDLs) are disclosed. Low temperature processed back side RDLs may be electrically connected to the... |
US-7,994,491 |
PCRAM device with switching glass layer A method of forming a memory device, such as a PCRAM, including selecting a chalcogenide glass backbone material for a resistance variable memory function and... |
US-7,994,464 |
Dual conversion gain gate and capacitor combination A pixel cell array architecture having a dual conversion gain. A dual conversion gain element is coupled between a floating diffusion region and a respective... |
US-7,993,988 |
Techniques for fabricating a non-planar transistor Methods for fabricating a non-planar transistor. Fin field effect transistors (finFETs) are often built around a fin (e.g., a tall, thin semiconductive member).... |
US-7,993,977 |
Method of forming molded standoff structures on integrated circuit devices A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a... |
US-7,993,957 |
Phase change memory cell and manufacturing method thereof using
minitrenches A process forms a phase change memory cell using a resistive element and a memory region of a phase change material. The resistive element has a first thin... |
US-7,993,944 |
Microelectronic imagers with optical devices having integral reference
features and methods for manufacturing... Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed... |
US-7,993,539 |
Methods of etching nanodots, methods of removing nanodots from substrates,
methods of fabricating integrated... Embodiments of the invention include methods of etching nanodots, to methods of removing nanodots from substrates, and to methods of fabricating integrated... |
US-7,992,297 |
Method for forming a circuit board via structure for high speed signaling One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage... |
US-7,992,060 |
Apparatus, methods, and system of NAND defect management Various embodiments comprise apparatus, methods, and systems including method comprising searching for a group address among a plurality of group addresses in a... |
US-7,991,947 |
Multi-priority encoder A multi-priority encoder includes a plurality of interconnected, single-priority encoders arranged in descending priority order. The multi-priority encoder... |
US-7,991,098 |
Method and apparatus for training the reference voltage level and data
sample timing in a receiver Methods and apparatuses for calculating the location of an optimal sampling point for a receiver system are disclosed. In brief, a first method comprises... |
US-7,990,802 |
Selective edge phase mixing Electronic apparatus, systems, and methods to implement selective edge phase mixing are disclosed. A selective edge phase mixing system includes a processor and... |
US-7,990,792 |
Hybrid sense amplifier and method, and memory device using same Sense circuits, devices and methods are disclosed, including a sense amplifier circuit that has first and second complementary data lines and a sensing circuit.... |
US-7,990,775 |
Methods of operating memory devices including different sets of logical
erase blocks Methods of operating memory devices include storing data of a first type in a first set of logical erase blocks and storing data of a second type in a second... |
US-7,990,772 |
Memory device having improved programming operation Some embodiments include methods and devices having a module and memory cells. The module is configured to reduce the amount of electrons in the sources and... |
US-7,990,763 |
Memory with weighted multi-page read A memory device provides increased output data to help evaluate data errors arising from bit line coupling and floating gate coupling during a read operation.... |
US-7,990,427 |
Method and apparatus for applying tonal correction to images A method and apparatus for applying tonal correction to images to obtain a more pleasing photographic image by redistributing low-key, mid-tone and high-key... |
US-7,990,391 |
Memory system having multiple address allocation formats and method for
use thereof A memory system having multiple address allocation methods for graphics data in a computer graphics processing system. The memory system includes a plurality of... |
US-7,990,163 |
Systems and methods for defect testing of externally accessible integrated
circuit interconnects Apparatus and methods provide built-in testing enhancements in integrated circuits. These testing enhancements permit, for example, continuity testing to pads... |
US-7,989,957 |
Self-aligned, integrated circuit contact Embodiments concern contacts for use in integrated circuits, which have a reduced likelihood of shorting to unrelated portions of an overlying conductive layer... |
US-7,989,870 |
Use of dilute steam ambient for improvement of flash devices A flash memory integrated circuit and a method for fabricating the same. A gate stack includes an initial oxide layer directly in contact with a silicon layer,... |
US-7,989,866 |
DRAM layout with vertical FETS and method of formation DRAM cell arrays having a cell area of about 4 F.sup.2 comprise an array of vertical transistors with buried bit lines and vertical double gate electrodes. The... |
US-7,989,864 |
Methods for enhancing capacitors having roughened features to increase
charge-storage capacity Structures and methods for making a semiconductor structure are discussed. The semiconductor structure includes a rough surface having protrusions formed from... |
US-7,989,362 |
Hafnium lanthanide oxynitride films Electronic apparatus and methods of forming the electronic apparatus include a hafnium lanthanide oxynitride film on a substrate for use in a variety of... |
US-7,989,360 |
Semiconductor processing methods, and methods for forming silicon dioxide Some embodiments include methods for semiconductor processing. A semiconductor substrate may be placed within a reaction chamber. The semiconductor substrate... |
US-7,989,349 |
Methods of manufacturing nanotubes having controlled characteristics A method of forming a plurality of nanotubes is disclosed. Particularly, a substrate may be provided and a plurality of recesses may be formed therein. Further,... |
US-7,989,345 |
Methods of forming blind wafer interconnects, and related structures and
assemblies Methods for forming blind wafer interconnects (BWIs) from the back side surface of a substrate structure to the underside of a bond pad on the opposing surface... |
US-7,989,340 |
Methods of forming CoSi.sub.2, methods of forming field effect
transistors, and methods of forming conductive... The invention included to methods of forming CoSi.sub.2, methods of forming field effect transistors, and methods of forming conductive contacts. In one... |
US-7,989,336 |
Methods of forming a plurality of conductive lines in the fabrication of
integrated circuitry, methods of... A method of forming a pair of conductive lines in the fabrication of integrated circuitry includes forming a trench into a damascene material received over a... |
US-7,989,322 |
Methods of forming transistors Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for... |