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Patent # Description
US-7,683,022 Methods of removing metal-containing materials
Various methods for selectively etching metal-containing materials (such as, for example, metal nitrides, which can include, for example, titanium nitride)...
US-7,683,021 Methods of removing metal-containing materials
Various methods for selectively etching metal-containing materials (such as, for example, metal nitrides, which can include, for example, titanium nitride)...
US-7,683,020 Methods of removing metal-containing materials
Various methods for selectively etching metal-containing materials (such as, for example, metal nitrides, which can include, for example, titanium nitride)...
US-7,683,001 Dielectric layers and memory cells including metal-doped alumina
A method of forming (and an apparatus for forming) a metal-doped aluminum oxide layer on a substrate, particularly a semiconductor substrate or substrate...
US-7,682,992 Resistance variable memory with temperature tolerant materials
A PCRAM memory device having a chalcogenide glass layer, preferably comprising antimony selenide having a stoichometric formula of about Sb.sub.2Se.sub.3, and a...
US-7,682,977 Methods of forming trench isolation and methods of forming arrays of FLASH memory cells
This invention includes methods of forming trench isolation. In one implementation, isolation trenches are provided within a semiconductor substrate. A liquid is...
US-7,682,962 Method for fabricating stacked semiconductor components with through wire interconnects
A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back...
US-7,682,924 Methods of forming a plurality of capacitors
A method of forming a plurality of capacitors includes an insulative material received over a capacitor array area and a circuitry area. The array area comprises...
US-7,682,869 Method of packaging integrated circuit devices using preformed carrier
Disclosed is a method of packaging integrated circuit devices using a preformed carrier. In one illustrative embodiment, the method includes providing a carrier...
US-7,682,847 Method for sorting integrated circuit devices
A method for sorting integrated circuit (IC) devices of the type having a substantially unique identification (ID) code, such as a fuse ID, including...
US-7,681,163 Capacitor layout technique for reduction of fixed pattern noise in a CMOS sensor
A new capacitor architecture includes a front plate of the capacitor formed from a first polysilicon layer. The front plate is surrounded by a first dielectric...
US-7,681,006 Asynchronously-accessible memory device with mode selection circuitry for burst or pipelined operation
An integrated circuit memory device is designed for high speed data access and for compatibility with existing memory systems. An address strobe signal is used...
US-7,681,005 Asynchronously-accessible memory device with mode selection circuitry for burst or pipelined operation
An integrated circuit memory device is designed for high speed data access and for compatibility with existing memory systems. An address strobe signal is used...
US-7,679,961 Programming and/or erasing a memory device in response to its program and/or erase history
For one embodiment, a program starting voltage of one or more program pulses applied to one or more memory cells is in response, at least in part, to on a number...
US-7,679,389 Probe for electrical test and electrical connecting apparatus using it
A probe includes an arm region extending in the back and forth direction, and a tip region extending downward from the front end portion of the arm region. The...
US-7,679,198 Circuit and method for interconnecting stacked integrated circuit dies
Signals are routed to and from identical stacked integrated circuit dies by selectively coupling first and second bonding pads on each of the dies to respective...
US-7,679,193 Use of AIN as cooper passivation layer and thermal conductor
A copper interconnect structure is disclosed as comprising a copper layer and an aluminum nitride layer formed over the copper layer. The aluminum nitride layer...
US-7,679,179 Castellation wafer level packaging of integrated circuit chips
Systems and methods for packaging integrated circuit chips in castellation wafer level packaging are provided. The active circuit areas of the chips are coupled...
US-7,679,118 Vertical transistor, memory cell, device, system and method of forming same
A memory device, system and fabrication method relating to a vertical memory cell including a semiconducting pillar extending outwardly from an integrally...
US-7,678,708 Systems and methods for forming metal oxide layers
A method of forming (and apparatus for forming) a metal oxide layer, preferably a dielectric layer, on a substrate, particularly a semiconductor substrate or...
US-7,678,691 Method of making a semiconductor device having improved contacts
A semiconductor device and fabrication process wherein the device includes a conductive layer with a localized thick region positioned below the contact hole. In...
US-7,678,678 Method to chemically remove metal impurities from polycide gate sidewalls
An embodiment includes a process of forming a gate stack that acts to resist the redeposition to the semiconductive substrate of mobilized metal such as from a...
US-7,678,648 Subresolution silicon features and methods for forming the same
Novel etch techniques are provided for shaping silicon features below the photolithographic resolution limits. FinFET devices are defined by recessing oxide and...
US-7,678,460 Intermediate semiconductor device structures using photopatternable, dielectric materials
A cap layer that enables a photopatternable, spin-on material to be used in the formation of semiconductor device structures at wavelengths that were previously...
US-7,677,796 System and method for providing temperature data from a memory device having a temperature sensor
A circuit and method for providing temperature data indicative of a temperature measured by a temperature sensor. The circuit is coupled to the temperature...
US-7,677,429 Concave face wire bond capillary and method
An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding...
US-7,676,919 Method for forming a circuit board via structure for high speed signaling
A method for forming a via in a printed circuit board is disclosed, which via allows for the passage of a signal from one signal plane to another in the (PCB),...
US-7,676,710 Error detection, documentation, and correction in a flash memory device
A memory device has an error documentation memory array that is separate from the primary memory array. The error documentation memory array stores data relating...
US-7,676,648 Method for manipulating data in a group of processing elements to perform a reflection of the data
A method for generating a reflection of data in a plurality of processing elements comprises shifting the data along, for example, each row in the array until...
US-7,676,627 Single segment data object management
A single segment data structure and method for storing data objects employing a single segment data object having a header and a data record. The header includes...
US-7,675,778 Memory devices having reduced word line current and method of operating and manufacturing the same
There is provided a memory array and methods for manufacturing the same. In one embodiment, there is provided a string comprising a plurality of transistors....
US-7,675,772 Multilevel memory cell operation
One or more embodiments of the present disclosure provide methods, devices, and systems for operating non-volatile multilevel memory cells. One method embodiment...
US-7,675,526 System and method for multi-sampling primitives to reduce aliasing
A method and system for performing multi-sample, antialiased rendering of images by performing multi-sample antialiasing at the primitive level. Geometric...
US-7,675,324 Pre-driver logic
At least one of the disclosed systems includes driver logic that is capable of driving a device and pre-driver logic coupled to the driver logic and that drives...
US-7,675,169 Apparatus and method for packaging circuits
Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The...
US-7,675,131 Flip-chip image sensor packages and methods of fabricating the same
There is provided an imager package including an image sensor die attached to a transparent substrate such that sensitive image sensing components on the sensor...
US-7,675,093 Antiblooming imaging apparatus, system, and methods
Apparatus, systems and methods are described to assist in reducing dark current in an active pixel sensor. A potential barrier arrangement is configured to block...
US-7,674,698 Metal-substituted transistor gates
One aspect of this disclosure relates to a method for forming an integrated circuit. According to various embodiments of the method, a plurality of transistors...
US-7,674,683 Bulk-isolated PN diode and method of forming a bulk-isolated PN diode
A technique for making a bulk isolated PN diode is disclosed. In one embodiment, a method may include providing a substrate having a doped region and disposing a...
US-7,674,670 Methods of forming threshold voltage implant regions
The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger...
US-7,674,669 FIN field effect transistor
Methods, devices and systems for a FinFET are provided. One method embodiment includes forming a FinFET by forming a relaxed silicon germanium...
US-7,674,655 Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first...
Semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a method of...
US-7,674,652 Methods of forming an integrated circuit package
A technique for making an integrated circuit package. Specifically, a stacked memory device is provided with minimal interconnects. Memory die are stacked on top...
US-7,673,094 Memory devices with buffered command address bus
Circuits and methods are provided that alleviate overloading of the command address bus and limit decreases in command address bus bandwidth to allow increased...
US-7,672,171 Non-planar flash memory array with shielded floating gates on silicon mesas
A first plane of memory cells is formed on mesas of the array. A second plane of memory cells is formed in valleys adjacent to the mesas. The second plurality of...
US-7,671,914 Increasing readout speed in CMOS APS sensors through block readout
A method and associated architecture for dividing column readout circuitry in an active pixel sensor in a manner which reduces the parasitic capacitance on the...
US-7,671,648 System and method for an accuracy-enhanced DLL during a measure initialization mode
A clock generator having a delay locked loop and a delay control circuit. The delay locked loop receives an input clock signal and adjusts an adjustable delay...
US-7,671,647 Apparatus and method for trimming static delay of a synchronizing circuit
A system and method for trimming an unadjusted forward delay of a delay-locked loop (DLL) and trimming a duty cycle of first and second output clock signals...
US-7,671,644 Process insensitive delay line
A delay line including a phase detector having two inputs and one output. The first input of the phase detector is connected to an input of the delay line. The...
US-7,671,459 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
Stacked microelectronic devices and methods for manufacturing such devices are disclosed herein. In one embodiment, a stacked microelectronic device assembly can...
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